Dry Etching Recipes: Difference between revisions

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! width="300" bgcolor="#D0E7FF" align="center" colspan="4" | '''[[ICP Etching Recipes|ICP Etching]]'''
! width="300" bgcolor="#D0E7FF" align="center" colspan="4" | '''[[ICP Etching Recipes|ICP Etching]]'''
! bgcolor="#D0E7FF" align="center" colspan="4"|'''[[Oxygen Plasma System Recipes|Oxygen Plasma Systems]]'''
! bgcolor="#D0E7FF" align="center" colspan="4"|'''[[Oxygen Plasma System Recipes|Oxygen Plasma Systems]]'''
! bgcolor="#D0E7FF" align="center" |'''[[Other Dry Etcher Recipes|Other Dry Etchers]]'''
! bgcolor="#D0E7FF" align="center" colspan="2" |'''[[Other Dry Etcher Recipes|Other Dry Etchers]]'''
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|-
! width="65" bgcolor="#D0E7FF" align="center" | '''Material'''
! width="65" bgcolor="#D0E7FF" align="center" | '''Material'''
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| width="85" bgcolor="#DAF1FF" | [[Plasma Activation (EVG 810)|Plasma Activation<br>(EVG 810)]]
| width="85" bgcolor="#DAF1FF" | [[Plasma Activation (EVG 810)|Plasma Activation<br>(EVG 810)]]
| width="85" bgcolor="#DAF1FF" | [[XeF2 Etch (Xetch)|XeF2 Etch<br>(Xetch)]]
| width="85" bgcolor="#DAF1FF" | [[XeF2 Etch (Xetch)|XeF2 Etch<br>(Xetch)]]
| width="85" bgcolor="#DAF1FF" | [[Vapor HF Etch (uETCH)|Vapor HF Etch<br>(uETCH)]]
|-bgcolor ="#EEFFFF"
|-bgcolor ="#EEFFFF"
! bgcolor="#D0E7FF" align="center" | Al
! bgcolor="#D0E7FF" align="center" | Al

Revision as of 23:28, 28 January 2014