Thermal Evap 2 (Solder): Difference between revisions
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{{tool2|{{PAGENAME}} |
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|picture=Thermal2.jpg |
|picture=Thermal2.jpg |
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|type = Vacuum Deposition |
|type = Vacuum Deposition |
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|super= |
|super= Michael Barreraz |
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|super2= Don Freeborn |
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|location=Bay 3 |
|location=Bay 3 |
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|description = ? |
|description = ? |
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= About = |
== About == |
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Thermal evaporator #2 is the designated "Solder" evaporator. The tool is used primarily for solder materials including Gold, Indium and Tin. |
Thermal evaporator #2 is the designated "Solder" evaporator. The tool is used primarily for solder materials including Gold, Indium and Tin. See the Recipes section below for other materials used. |
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Use this tool for materials with low melting temperatures, or for materials that have a high risk of contamination in the e-beam evaporators. |
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Wafers up to 12" can be mounted. |
Wafers up to 12" can be mounted. |
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=Documentation= |
==Documentation== |
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*[ |
*[//wiki.nanotech.ucsb.edu/w/images/b/b3/Thermal_Evaporator2.pdf Operating Instructions] |
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*[https://wiki.nanofab.ucsb.edu/w/images/1/17/Thermal_Evaporator2-Normal_Fixture-_Indium_Deposition.pdf Using Normal Fixture] |
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*[https://wiki.nanofab.ucsb.edu/w/images/d/d1/Thermal_Evaprator2-Cold_Fixture-Indium_Deposition.pdf Using Cold Fixture] |
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*[https://wiki.nanofab.ucsb.edu/w/images/7/74/Thermal_Evap_2_pump_down_procedure-New-_5-29-25.pdf Temp Pump Down SOP as of 5-29-25] |
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== Recipes == |
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* [[Thermal Evaporation Recipes#Thermal Evaporator 2|Recipes > Thermal Evaporation Recipes > Thermal Evaporator 2]] |
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** ''Visit this page for the materials table and evaporation parameters for all materials available.'' |
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* [https://wiki.nanofab.ucsb.edu/w/images/0/05/Sn_deposition_in_Thermal_Evaporator2.pdf Tin deposition] |
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== Plot == |
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= Materials Table = |
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* [https://wiki.nanofab.ucsb.edu/w/images/b/bb/Thermal_Evaporator2-Plot.png Plot for Indium Deposition] |
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For the materials tables, please visit the [[Thermal_Evaporation_Recipes#Materials_Table_(Thermal Evaporator #1)|Thermal Evaporation Recipe Page]]. |
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Latest revision as of 21:35, 19 June 2025
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About
Thermal evaporator #2 is the designated "Solder" evaporator. The tool is used primarily for solder materials including Gold, Indium and Tin. See the Recipes section below for other materials used.
Use this tool for materials with low melting temperatures, or for materials that have a high risk of contamination in the e-beam evaporators.
Detailed Specifications
Wafers up to 12" can be mounted.
Documentation
Recipes
- Recipes > Thermal Evaporation Recipes > Thermal Evaporator 2
- Visit this page for the materials table and evaporation parameters for all materials available.
- Tin deposition
