Wafer Bonder (Logitech WBS7): Difference between revisions
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{{tool2|{{PAGENAME}} |
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|picture=Logitech_WSBU-6_Wafer_Bonder_-_photo_-_800px.png |
|picture=Logitech_WSBU-6_Wafer_Bonder_-_photo_-_800px.png |
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|type = Thermal Processing |
|type = Thermal Processing |
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|super= |
|super= Bill Millerski |
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|super2= Don Freeborn |
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|phone=(805)839-3918x216 |
|phone=(805)839-3918x216 |
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|location=Bay 5 |
|location=Bay 5 |
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|manufacturer = Logitech |
|manufacturer = Logitech |
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}} |
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==About== |
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This tool is most often used for bonding samples to Silicon carrier wafers with CrystalBond wax. |
This tool is most often used for bonding samples to Silicon carrier wafers with CrystalBond wax. |
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This mounting method can be used for |
This mounting method can be used for |
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* |
*securing smaller parts for use on 100mm tools (such as the [[Chemical-Mechanical Polisher (Logitech)|CMP]]) |
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* |
*providing a carrier wafer for through-etching of Silicon wafers on the [[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Bosch Etcher]] |
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* for dicing |
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*for [[Dicing Saw (ADT)|dicing]] |
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*for [[lithography]] |
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A user can place the two wafers to be bonded in contact, with the adhesive in between (such as wax, photoresist etc.). A rubber membrane is lowered on top, creating a small vacuum chamber. The tool can then be programmed to heat the wafers and melt the wax/cure the adhesive, while vacuum is pulled in the chamber, which pulls the rubber membrane down onto the top wafer. This flattens the bond and evacuates bubbles from between the wafers, providing a planar bond. |
A user can place the two wafers to be bonded in contact, with the adhesive in between (such as wax, photoresist etc.). A rubber membrane is lowered on top, creating a small vacuum chamber. The tool can then be programmed to heat the wafers and melt the wax/cure the adhesive, while vacuum is pulled in the chamber, which pulls the rubber membrane down onto the top wafer. This flattens the bond and evacuates bubbles from between the wafers, providing a planar bond. |
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We also have recipes for spin-coating the crystalbond wax, allowing for a uniform coating of the adhesive wax. |
We also have recipes for spin-coating the crystalbond wax, allowing for a uniform coating of the adhesive wax. |
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==Detailed Specifications== |
==Detailed Specifications== |
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*Substrate Size: 4"-6" |
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*Temperature Range: 20°C-188°C |
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==Operation Procedures== |
==Operation Procedures== |
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* [https://wiki.nanofab.ucsb.edu/w/images/7/7a/Logitech_Wafer_Bonder_Operating_Instructions.pdf Wafer Bonder Operation Procedure] |
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''Known working recipes for bonding wafers, and tips & tricks for developing your own:'' |
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Latest revision as of 21:50, 30 October 2023
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About
This tool is most often used for bonding samples to Silicon carrier wafers with CrystalBond wax.
This mounting method can be used for
- securing smaller parts for use on 100mm tools (such as the CMP)
- providing a carrier wafer for through-etching of Silicon wafers on the Bosch Etcher
- for dicing
- for lithography
A user can place the two wafers to be bonded in contact, with the adhesive in between (such as wax, photoresist etc.). A rubber membrane is lowered on top, creating a small vacuum chamber. The tool can then be programmed to heat the wafers and melt the wax/cure the adhesive, while vacuum is pulled in the chamber, which pulls the rubber membrane down onto the top wafer. This flattens the bond and evacuates bubbles from between the wafers, providing a planar bond.
We also have recipes for spin-coating the crystalbond wax, allowing for a uniform coating of the adhesive wax.
Detailed Specifications
- Substrate Size: 4"-6"
- Temperature Range: 20°C-188°C
Operation Procedures
Recipes
Known working recipes for bonding wafers, and tips & tricks for developing your own:
- Recipes > Packaging Recipes > Wafer Bonder (Logitech WBS7)