Thermal Evap 2 (Solder): Difference between revisions
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{{tool2|{{PAGENAME}} |
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|picture=Thermal2.jpg |
|picture=Thermal2.jpg |
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|type = Vacuum Deposition |
|type = Vacuum Deposition |
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|super= |
|super= Michael Barreraz |
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|super2= Don Freeborn |
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|location=Bay 3 |
|location=Bay 3 |
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|description = ? |
|description = ? |
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= About = |
== About == |
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Thermal evaporator #2 is the designated "Solder" evaporator. The tool is used primarily for solder materials including Gold, Indium and Tin. |
Thermal evaporator #2 is the designated "Solder" evaporator. The tool is used primarily for solder materials including Gold, Indium and Tin. See the Recipes section below for other materials used. |
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Use this tool for materials with low melting temperatures, or for materials that have a high risk of contamination in the e-beam evaporators. |
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Wafers up to 12" can be mounted. |
Wafers up to 12" can be mounted. |
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=Documentation= |
==Documentation== |
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*[ |
*[//wiki.nanotech.ucsb.edu/w/images/b/b3/Thermal_Evaporator2.pdf Operating Instructions] |
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== Recipes == |
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= Materials Table = |
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* [[Thermal Evaporation Recipes#Thermal Evaporator 2|Recipes > Thermal Evaporation Recipes > Thermal Evaporator 2]] |
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** ''Visit this page for the materials table and evaporation parameters for all materials available.'' |
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==Data== |
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[[Thermal Evaporation Recipes]] |
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Latest revision as of 17:29, 30 August 2022
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About
Thermal evaporator #2 is the designated "Solder" evaporator. The tool is used primarily for solder materials including Gold, Indium and Tin. See the Recipes section below for other materials used.
Use this tool for materials with low melting temperatures, or for materials that have a high risk of contamination in the e-beam evaporators.
Detailed Specifications
Wafers up to 12" can be mounted.
Documentation
Recipes
- Recipes > Thermal Evaporation Recipes > Thermal Evaporator 2
- Visit this page for the materials table and evaporation parameters for all materials available.