Wafer Coating Process Traveler: Difference between revisions

From UCSB Nanofab Wiki
Jump to navigation Jump to search
No edit summary
 
(4 intermediate revisions by the same user not shown)
Line 1: Line 1:
There are three standard recipes : STD SiO2, STD Nitride2, and STD LS Nitride2 at 300C. Instructions bellow explain how to run each of the recipes ( seasoning, deposition, cleaning)
There are three standard recipes : STD SiO2, STD Nitride2, and STD LS Nitride2 at 300C. Instructions bellow explain how to run each of the recipes ( seasoning, deposition, cleaning)


=== STD SiO2 ===
=== Standard Oxide Deposition ===


==== Standard oxide deposition ====
==== STD SiO2 ====
#Log in to Advanced PECVD #2
#Log in to Advanced PECVD #2
#Seasoning
#Seasoning
Line 10: Line 10:
#*Vent the chamber and load the substrate (place it in the center of platen). You can place small pieces around the wafer to protect it from moving.
#*Vent the chamber and load the substrate (place it in the center of platen). You can place small pieces around the wafer to protect it from moving.
#*Pump down.
#*Pump down.
#*Load the deposition recipe (SiN@250C), and run it. Deposition time is variable. Get the rate from [https://wiki.nanotech.ucsb.edu/wiki/Vacuum_Deposition_Recipes historical data].
#*Load the deposition recipe (STD SiO2), and run it. Deposition time is variable. Get the rate from [https://wiki.nanotech.ucsb.edu/wiki/PECVD_Recipes#PECVD_2_.28Advanced_Vacuum.29 historical data].
#*Unload the wafer.
#*Unload the wafer.
#Cleaning
#Cleaning
Line 16: Line 16:
#*Load the cleaning recipe (CH4/O2 clean). Edit the recipe and enter required time for cleaning.
#*Load the cleaning recipe (CH4/O2 clean). Edit the recipe and enter required time for cleaning.
#*Log out
#*Log out
=== STD Nitride2 ===
=== Standard Nitride Deposition ===


==== Standard nitride deposition ====
==== STD Nitride2 ====
#Log in to Advanced PECVD #2
#Seasoning
#*Load the seasoning recipe (STD Nitride2), and run it. The goal of this step is to coat oxide on chamber walls and prepare it for deposition.
#Deposition
#*Vent the chamber and load the substrate (place it in the center of platen). You can place small pieces around the wafer to protect it from moving.
#*Pump down.
#*Load the deposition recipe (STD Nitride2), and run it. Deposition time is variable. Get the rate from [https://wiki.nanotech.ucsb.edu/wiki/PECVD_Recipes#PECVD_2_.28Advanced_Vacuum.29 historical data].
#*Unload the wafer.
#Cleaning
#*Wipe sidewall first with DI water, followed by IPA.
#*Load the cleaning recipe (CH4/O2 clean). Edit the recipe and enter required time for cleaning.
#*Log out


=== STD LS Nitride2 ===
=== Standard Low Stress Deposition ===

==== STD LS Nitride2 ====
#Log in to Advanced PECVD #2
#Seasoning
#*Load the seasoning recipe (STD LS Nitride2), and run it. The goal of this step is to coat oxide on chamber walls and prepare it for deposition.
#Deposition
#*Vent the chamber and load the substrate (place it in the center of platen). You can place small pieces around the wafer to protect it from moving.
#*Pump down.
#*Load the deposition recipe (STD LS Nitride2), and run it. Deposition time is variable. Get the rate from [https://wiki.nanotech.ucsb.edu/wiki/PECVD_Recipes#PECVD_2_.28Advanced_Vacuum.29 historical data].
#*Unload the wafer.
#Cleaning
#*Wipe sidewall first with DI water, followed by IPA.
#*Load the cleaning recipe (CH4/O2 clean). Edit the recipe and enter required time for cleaning.
#*Log out


#
==== Standard low stress nitride deposition ====

Latest revision as of 23:54, 22 April 2020

There are three standard recipes : STD SiO2, STD Nitride2, and STD LS Nitride2 at 300C. Instructions bellow explain how to run each of the recipes ( seasoning, deposition, cleaning)

Standard Oxide Deposition

STD SiO2

  1. Log in to Advanced PECVD #2
  2. Seasoning
    • Load the seasoning recipe (STD SiO2), and run it. The goal of this step is to coat oxide on chamber walls and prepare it for deposition.
  3. Deposition
    • Vent the chamber and load the substrate (place it in the center of platen). You can place small pieces around the wafer to protect it from moving.
    • Pump down.
    • Load the deposition recipe (STD SiO2), and run it. Deposition time is variable. Get the rate from historical data.
    • Unload the wafer.
  4. Cleaning
    • Wipe sidewall first with DI water, followed by IPA.
    • Load the cleaning recipe (CH4/O2 clean). Edit the recipe and enter required time for cleaning.
    • Log out

Standard Nitride Deposition

STD Nitride2

  1. Log in to Advanced PECVD #2
  2. Seasoning
    • Load the seasoning recipe (STD Nitride2), and run it. The goal of this step is to coat oxide on chamber walls and prepare it for deposition.
  3. Deposition
    • Vent the chamber and load the substrate (place it in the center of platen). You can place small pieces around the wafer to protect it from moving.
    • Pump down.
    • Load the deposition recipe (STD Nitride2), and run it. Deposition time is variable. Get the rate from historical data.
    • Unload the wafer.
  4. Cleaning
    • Wipe sidewall first with DI water, followed by IPA.
    • Load the cleaning recipe (CH4/O2 clean). Edit the recipe and enter required time for cleaning.
    • Log out

Standard Low Stress Deposition

STD LS Nitride2

  1. Log in to Advanced PECVD #2
  2. Seasoning
    • Load the seasoning recipe (STD LS Nitride2), and run it. The goal of this step is to coat oxide on chamber walls and prepare it for deposition.
  3. Deposition
    • Vent the chamber and load the substrate (place it in the center of platen). You can place small pieces around the wafer to protect it from moving.
    • Pump down.
    • Load the deposition recipe (STD LS Nitride2), and run it. Deposition time is variable. Get the rate from historical data.
    • Unload the wafer.
  4. Cleaning
    • Wipe sidewall first with DI water, followed by IPA.
    • Load the cleaning recipe (CH4/O2 clean). Edit the recipe and enter required time for cleaning.
    • Log out