Template:Announcements: Difference between revisions
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=====Oxford Flexal ALD===== |
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The PM is proceeding slower than expected. As such, I currently anticipate that the tool will be available for use by the end of the day on Friday. |
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Cryo replaced, system ready for use. |
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Sorry for any inconvenience this may cause. |
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The tool is up, intial film checks show same dep. rates as before. |
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Bill Millerski |
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RIE 5 is up except for processes that use SiCl4. |
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This tool is down indefinitely. We are sourcing manual bonding fixtures, and already have a 1cm bonding fixture for NanoFab users to use - please contact [[Demis D. John]] for more information. |
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=====Dry Etch, Si Deep RIE (PlasmaTherm DSEIII) - DSE Update===== |
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The board we were waiting on arrived, but it did not resolve the tool issue. We are working with Panasonic on the next steps. |
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We received most of the chamber assembly replacement parts today. We are still waiting on the lamps and chamber o-rings which are scheduled to be delivered in the next couple of days. Once we have all the parts, we'll start to reassemble the chamber. |
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I'll send out an update in the next 2-3 days. |
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//[[User:Mehalana v|Vraj Mehalana]] 10:58, 5 February 2024 (PST) |
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=====ICP #1 is down - Update===== |
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Replacing the battery on the board did not resolve the tool issue. |
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Panasonic has located a replacement board for the tool. From what I gather they need to repair and test it and are hoping to have it ready to ship by the 16th. I'd like to add that there is the possibility that this will not resolve the issue but it is the best path forward at this point. |
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-Lee |
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//[[User:Mehalana v|Vraj Mehalana]] 09:39, 30 January 2024 (PST) |
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=====EBeam3 Transfer Arm Upgrade - Postponed===== |
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The Transfer Arm upgrade has been postponed again, this time due to motor driver compatibility issues. |
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I am waiting to hear back from the manufacturer so at this time I can not reschedule yet. |
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I will send another notification when everything has been worked out, and I am ready to schedule the installation. |
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//[[User:John_d|Demis D. John]] 11:56, 13 February 2024 (PST) |
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=====Job Opening: Process Engineer===== |
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The Nanofab has a current job opening for a Process/Wafer-Fab Engineer, see the [https://wiki.nanofab.ucsb.edu/wiki/Nanofab_Job_Postings NanoFab Job Openings page] for details. |
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//[[User:John d|Demis D. John]] 14:52, 30 October 2023 (PDT) |
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=====Lab Access Changes: Symmetry App===== |
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Card/Iris scanner access is still currently enabled. However we will be moving to a smartphone-based access system. '''IMPORTANT''': check your email to setup the new smartphone access system, so you will be ready when we switch to the new system. Look for an email titled '''''"Invitation to Access Symmetry App"'''''. |
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// [[User:John d|John d]] 13:49, 7 November 2023 (PST) |
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=====Wafer Bonder, (Suss SB6-8E)===== |
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SUSS aims to be on site in early February. We’ll will send out an email once I get confirmation for a specific date. |
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//[[User:Mehalana v|Vraj Mehalana]] 14:23, 13 December 2023 (PST) |
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Latest revision as of 22:24, 13 August 2025
Oxford Flexal ALD
The PM is proceeding slower than expected. As such, I currently anticipate that the tool will be available for use by the end of the day on Friday.
Sorry for any inconvenience this may cause.
Thanks Bill Millerski //Vraj Mehalana 21:12, 12 August 2025 (UTC)
Suss SB6-8E
This tool is down indefinitely. We are sourcing manual bonding fixtures, and already have a 1cm bonding fixture for NanoFab users to use - please contact Demis D. John for more information. // Demis D. John 04:28, 5 August 2025 (UTC)
ICP1 Down
The board we were waiting on arrived, but it did not resolve the tool issue. We are working with Panasonic on the next steps. //Vraj Mehalana 14:17, 1 March 2024 (PST)