Nanofab Job Postings: Difference between revisions

From UCSB Nanofab Wiki
Jump to navigation Jump to search
(added SUmmer '24 etch and dep internsip positions to OPEN positions)
mNo edit summary
 
(4 intermediate revisions by the same user not shown)
Line 3: Line 3:
==Current Openings==
==Current Openings==
''The following are positions we are currently hiring for:''
''The following are positions we are currently hiring for:''

===Process/Wafer Fab Engineer Level 2 (Staff Position)===
Apply at this link: [https://careerspub.universityofcalifornia.edu/psp/ucsb/EMPLOYEE/HRMS/c/HRS_HRAM.HRS_APP_SCHJOB.GBL?Page=HRS_APP_JBPST&Action=U&FOCUS=Applicant&SiteId=31&JobOpeningId=65571&PostingSeq=1 jobs.ucsb.edu (#65571) - R&D Engineer Level 2]

*Under the supervision of a R&D3 Engineer, develops processes and establishes process control on a variety of nanofabrication research tools within the facility, including thin film deposition, inductively coupled plasma etching, and projection lithography.
*Works to establish and document standard procedures as well as new process modules for a variety of nanofabrication processes through direct hands-on processing and results documentation.
*Assigned work will support engineering staff, facility users, and facility projects.

===Process/Wafer Fab Engineer Level 3 (Staff position)===
'''''We are no longer reviewing applications for this position'''''
Apply at this link: [https://careerspub.universityofcalifornia.edu/psp/ucsb/EMPLOYEE/HRMS/c/HRS_HRAM.HRS_APP_SCHJOB.GBL?Page=HRS_APP_JBPST&Action=U&FOCUS=Applicant&SiteId=31&JobOpeningId=60935&PostingSeq=1 jobs.ucsb.edu (# 60935): Research & Development Engineer level 3]

*Process Development for Fab processes: Developing and executing fabrication processes for external customers and internal lab needs.
*Process Development for Lab equipment: Developing new recipes and designing/running DOE's for new/existing lab equipment.
*User Support: Giving fabrication advice to internal/external users.
*Process Control: Observing + Troubleshooting process drift/deviations, improving process repeatability.


=== Intern - Processing Technician - Thin-Film Characterizations ===
=== Intern - Processing Technician - Thin-Film Characterizations ===
*'''WINTER 2026 position specifically'''

*'''SUMMER 2024 position specifically'''
*This position is for current UCSB Undergraduate students. Ideally in a technical field, optionally having taken one of the cleanroom course (neither are required).
*This position is for current UCSB Undergraduate students. Ideally in a technical field, optionally having taken one of the cleanroom course (neither are required).


Line 28: Line 11:
*Running thin-film deposition calibrations on various high-use deposition tools, as listed on the [[Process Group - Process Control Data#Deposition .28Process Control Data.29|Deposition: Process Control data]].
*Running thin-film deposition calibrations on various high-use deposition tools, as listed on the [[Process Group - Process Control Data#Deposition .28Process Control Data.29|Deposition: Process Control data]].
**These are user-accessible (public) charts and data that users consult to ensure the tools are operating as expected, and/or for troubleshooting problems in the fabrication process.
**These are user-accessible (public) charts and data that users consult to ensure the tools are operating as expected, and/or for troubleshooting problems in the fabrication process.
*Will transition into Lithography and Plasma-Etch calibrations over time.


=== Intern - Processing Technician - Etch Characterizations ===
===Intern - Processing Technician - Etch Characterizations===


*'''SUMMER 2024 position specifically'''
*'''WINTER 2026 position specifically'''
*This position is for current UCSB Undergraduate students. Ideally in a technical field, optionally having taken one of the cleanroom course (neither are required).
*This position is for current UCSB Undergraduate students. Ideally in a technical field, optionally having taken one of the cleanroom course (neither are required).


Line 37: Line 21:
*Running plasma etch calibrations and SEM on various high-use etch tools, as listed on the [[Process Group - Process Control Data#Etching .28Process Control Data.29|Etching: Process Control data]].
*Running plasma etch calibrations and SEM on various high-use etch tools, as listed on the [[Process Group - Process Control Data#Etching .28Process Control Data.29|Etching: Process Control data]].
**These are user-accessible (public) charts and data that users consult to ensure the tools are operating as expected, and/or for troubleshooting problems in the fabrication process.
**These are user-accessible (public) charts and data that users consult to ensure the tools are operating as expected, and/or for troubleshooting problems in the fabrication process.
*Will transition into Lithography and Vacuum Deposition calibrations over time.


==Filled/Closed Positions==
==Filled/Closed Positions==

''none''
*'''''Internships are FULL through December 2025.'''''

==View all Nanofab Job Openings==
==View all Nanofab Job Openings==
To search for available NanoFab job positions, follow these instructions:
To search for available NanoFab job positions, follow these instructions:

Latest revision as of 17:15, 6 May 2025

You can see our Organization Chart here: https://www.nanotech.ucsb.edu/staff

Current Openings

The following are positions we are currently hiring for:

Intern - Processing Technician - Thin-Film Characterizations

  • WINTER 2026 position specifically
  • This position is for current UCSB Undergraduate students. Ideally in a technical field, optionally having taken one of the cleanroom course (neither are required).
  • A position in the "Process Group", led by Demis D. John.
  • Running thin-film deposition calibrations on various high-use deposition tools, as listed on the Deposition: Process Control data.
    • These are user-accessible (public) charts and data that users consult to ensure the tools are operating as expected, and/or for troubleshooting problems in the fabrication process.
  • Will transition into Lithography and Plasma-Etch calibrations over time.

Intern - Processing Technician - Etch Characterizations

  • WINTER 2026 position specifically
  • This position is for current UCSB Undergraduate students. Ideally in a technical field, optionally having taken one of the cleanroom course (neither are required).
  • A position in the "Process Group", led by Demis D. John.
  • Running plasma etch calibrations and SEM on various high-use etch tools, as listed on the Etching: Process Control data.
    • These are user-accessible (public) charts and data that users consult to ensure the tools are operating as expected, and/or for troubleshooting problems in the fabrication process.
  • Will transition into Lithography and Vacuum Deposition calibrations over time.

Filled/Closed Positions

  • Internships are FULL through December 2025.

View all Nanofab Job Openings

To search for available NanoFab job positions, follow these instructions:

  1. Follow the appropriate link:
    1. Staff Jobs for "External Applicants" - not a current UCSB employee
    2. Staff Jobs for "Internal Applicants" - for current UCSB employees
  2. In the "keywords" search field, search for "NanoFab".
    • All available NanoFab job postings should be listed.

(The same can be done by going to https://www.jobs.ucsb.edu/ > scroll to Browse Jobs > Choose Internal or External applicant.)