Thermal Evap 2 (Solder): Difference between revisions

From UCSB Nanofab Wiki
Jump to navigation Jump to search
No edit summary
 
(62 intermediate revisions by 4 users not shown)
Line 1: Line 1:
{{tool|{{PAGENAME}}
{{tool2|{{PAGENAME}}
|picture=Thermal2.jpg
|picture=Thermal2.jpg
|type = Vacuum Deposition
|type = Vacuum Deposition
|super= Brian Lingg
|super= Michael Barreraz
|super2= Don Freeborn
|location=Bay 3
|location=Bay 3
|description = ?
|description = ?
Line 10: Line 11:
}}
}}


= About =
== About ==
Thermal evaporator #2 is the designated "Solder" evaporator. The tool is used primarily for solder materials including Gold, Indium and Tin. See the Recipes section below for other materials used.


Use this tool for materials with low melting temperatures, or for materials that have a high risk of contamination in the e-beam evaporators.
=Detailed Specifications=
*Standard 18" bell jar pumped by 8" Varian cryopump (HV8) driven by Ebara 2.1 compressor
*Low E-7 Torr ultimate pressure
*Rate Monitor: Maxtek TM-300
*Typical material rates: Al - 1 A/s @ 85 amps
**Au - 5 A/s @ 122 amps
**Cr - 2 A/s @ 85 amps
**Zn - 4.5 A/s @ 50 amps


== Detailed Specifications ==
= Materials Table =
Wafers up to 12" can be mounted.


==Documentation==
{| border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%" class="collapsible collapsed wikitable"
*[//wiki.nanotech.ucsb.edu/w/images/b/b3/Thermal_Evaporator2.pdf Operating Instructions]
|-

! colspan=8 width=1300 height=35 bgcolor="#D0E7FF" align="center"|<div style="font-size: 150%;">Materials Table</div>
== Recipes ==
|- bgcolor="#D0E7FF"
* [[Thermal Evaporation Recipes#Thermal Evaporator 2|Recipes > Thermal Evaporation Recipes > Thermal Evaporator 2]]
! width="45" bgcolor="#D0E7FF" align="center" | '''Material'''
** ''Visit this page for the materials table and evaporation parameters for all materials available.''
! width="45" bgcolor="#D0E7FF" align="center" | '''Symbol'''
! width="45" bgcolor="#D0E7FF" align="center" | '''Density, g/cm3'''
! width="45" bgcolor="#D0E7FF" align="center" | '''Z Ratio'''
! width="45" bgcolor="#D0E7FF" align="center" | '''Tooling, %'''
! width="45" bgcolor="#D0E7FF" align="center" | '''Current, Amp'''
! width="45" bgcolor="#D0E7FF" align="center" | '''Dep.rate, A/sec'''
! width="100" bgcolor="#D0E7FF" align="center" | '''Comments'''
|-

Latest revision as of 17:29, 30 August 2022

Thermal Evap 2 (Solder)
Thermal2.jpg
Location Bay 3
Tool Type Vacuum Deposition
Manufacturer Custom
Description ?

Primary Supervisor Michael Barreraz
(805) 893-4147
mikebarreraz@ece.ucsb.edu

Secondary Supervisor

Don Freeborn


Recipes Vacuum Deposition Recipes

SignupMonkey: Sign up for this tool


About

Thermal evaporator #2 is the designated "Solder" evaporator. The tool is used primarily for solder materials including Gold, Indium and Tin. See the Recipes section below for other materials used.

Use this tool for materials with low melting temperatures, or for materials that have a high risk of contamination in the e-beam evaporators.

Detailed Specifications

Wafers up to 12" can be mounted.

Documentation

Recipes