Tube Furnace (Tystar 8300): Difference between revisions

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|description = Tystar 8" 3-Tube Oxidation/Annealing System
|description = Tystar 8" 3-Tube Oxidation/Annealing System
|manufacturer = Tystar Corporation
|manufacturer = Tystar Corporation
|model = Tystar 8300
|materials =
|materials =
|toolid=999
|toolid=999
}}
}}
= About =
==About==
The three stack Tystar 8” furnace is used primarily for 3 processes. The processes are dedicated for one tube each:
The three stack Tystar 8” furnace is used primarily for 3 processes. The processes are dedicated for specific tubes as follows:
# SOG curing - Tube 1
⚫
# Dry or wet oxidation of silicon - Tubes 2 and 3
# General furnace annealing - Tube 3


*'''Tube #1''': SOG curing & low-temp oxidation
⚫
The tubes can hold up to one hundred 8” wafers per tube per cycle. We have boats for various wafer sizes, including pieces. The maximum temperature is 1050°C for the system. Gases used are O<sub>2</sub>, Steam from DI-H<sub>2</sub>O, N<sub>2</sub>.
⚫
*'''Tubes #2 and #3''': Dry or wet oxidation of silicon (unprocessed, clean)
*'''Tube #3''': General furnace annealing & oxidation, including processed material


⚫
Each process tube can accomodate up to one hundred 8” wafers per cycle. We have boats for 2", 3", 4", 6", 8" and irregular shaped pieces. The maximum temperature is 1100°C for the system. Gases used are O<sub>2</sub>, Steam from DI-H<sub>2</sub>O, N<sub>2</sub>.
⚫
=Process Information=


⚫
==Process Information==
⚫
=Recipes=


Recipe Characterization Data, such as thermal oxidation times, can be found on the recipe page:
⚫
=Useful Information=

⚫
[[Media:TystarMechDrawWaferBoat.pdf|Tystar Wafer Boat Drawing - 4" Wafer with 0.5mm Slots]]
*[[Thermal Processing Recipes|Thermal Processing Recipes: Tystar 8300]]

Use the [http://cleanroom.byu.edu/OxideTimeCalc BYU] or [http://www.lelandstanfordjunior.com/thermaloxide.html Stanford Leland Jr.] Thermal Oxidation Calculators to determine the time and temperature that will be necessary for your process needs. You can "calibrate" your oxidations to the Stanford calculator by adjusting the ''Partial Pressure'' on the calculator to match your experimental data.

Keep in mind that all process must be 30 minutes in length at a minimum. Processes less than 30 minutes will suffer from poor uniformity because the process tube will not have sufficient time to saturate with O<sub>2</sub> or DI-H<sub>2</sub>O.

===Gases Available===

*N2 (15/5 slpm)
*O2 High-range "O2HI" - 15 slpm
*O2 Low-range "O2LO" - 1 slpm
*All gasses flow through the H2O bubbler, which can optionally be filled with heated water to flow steam, or evacuated (no steam, gas only).

⚫
==Recipes==

* '''Tube 1''' - low temperature tube. Applications: Wafer Bonding, Curing Spin-on-glass/dielectrics, AlGaAs oxidation, annealing.
* '''Tube 2''' - ''CLEAN'' Silicon only, Wet and Dry oxidations only.
* '''Tube 3''' - Wet/Dry Oxidation, Annealing
* [[Thermal Processing Recipes#Available Recipes (Tystar 8300)|'''Thermal Processing Recipes (Tystar 8300)''']] - lists all available recipes on each tube
* [[Thermal Processing Recipes#Process Limits (Tystar 8300)|'''Process Limits''']] - each tube has different process limits - see this page for requirements for each tube. Contact [[Tony Bosch|supervisor]] for advice on long (≥24hr) or high-temp processes.

===[[Thermal Processing Recipes#Tystar 8300|<u>Oxidation Rates & Data</u>]]===
''See the above recipes page for data on oxidation rates for standard oxidation recipes.''

⚫
==Useful Information==
⚫
[//wiki.nanotech.ucsb.edu/w/images/8/89/TystarMechDrawWaferBoat.pdf Tystar Wafer Boat Drawing - 4" Wafer with 0.5mm Slots]

⚫
==See Also==


⚫
=See Also=
*[http://www.tystar.com/ Tystar] - Manufacturer of the tool
*[http://www.tystar.com/ Tystar] - Manufacturer of the tool
*[http://www.cleanroom.byu.edu/OxideTimeCalc.phtml Silicon Thermal Oxide Thickness Calculator] - Use this on-line calculator to calculate times for silicon oxidation.
*[http://cleanroom.byu.edu/OxideThickCalc Silicon Thermal Oxide Thickness Calculator (BYU)] - Use this on-line calculator to calculate times for silicon oxidation.
*[http://www.lelandstanfordjunior.com/thermaloxide.html Advanced Silicon Thermal Oxide Thickness Calculator (Stanford Leland Jr.)] - Another thermal oxide calculator, with flexibility to vary ''partial pressure'' parameter to calibrate to your own process.

==Operational Instructions==

*[//wiki.nanotech.ucsb.edu/w/images/8/8a/Tystar_Operational_Procedure.pdf Operating Instructions]

Latest revision as of 22:00, 24 October 2024

Tube Furnace (Tystar 8300)
Tystar.jpg
Tool Type Thermal Processing
Location Bay 4
Supervisor Tony Bosch
Supervisor Phone (805) 893-3486
Supervisor E-Mail bosch@ece.ucsb.edu
Description Tystar 8" 3-Tube Oxidation/Annealing System
Manufacturer Tystar Corporation
Model Tystar 8300
Sign up for this tool


About

The three stack Tystar 8” furnace is used primarily for 3 processes. The processes are dedicated for specific tubes as follows:

  • Tube #1: SOG curing & low-temp oxidation
  • Tubes #2 and #3: Dry or wet oxidation of silicon (unprocessed, clean)
  • Tube #3: General furnace annealing & oxidation, including processed material

Each process tube can accomodate up to one hundred 8” wafers per cycle. We have boats for 2", 3", 4", 6", 8" and irregular shaped pieces. The maximum temperature is 1100°C for the system. Gases used are O2, Steam from DI-H2O, N2.

Process Information

Recipe Characterization Data, such as thermal oxidation times, can be found on the recipe page:

Use the BYU or Stanford Leland Jr. Thermal Oxidation Calculators to determine the time and temperature that will be necessary for your process needs. You can "calibrate" your oxidations to the Stanford calculator by adjusting the Partial Pressure on the calculator to match your experimental data.

Keep in mind that all process must be 30 minutes in length at a minimum. Processes less than 30 minutes will suffer from poor uniformity because the process tube will not have sufficient time to saturate with O2 or DI-H2O.

Gases Available

  • N2 (15/5 slpm)
  • O2 High-range "O2HI" - 15 slpm
  • O2 Low-range "O2LO" - 1 slpm
  • All gasses flow through the H2O bubbler, which can optionally be filled with heated water to flow steam, or evacuated (no steam, gas only).

Recipes

  • Tube 1 - low temperature tube. Applications: Wafer Bonding, Curing Spin-on-glass/dielectrics, AlGaAs oxidation, annealing.
  • Tube 2 - CLEAN Silicon only, Wet and Dry oxidations only.
  • Tube 3 - Wet/Dry Oxidation, Annealing
  • Thermal Processing Recipes (Tystar 8300) - lists all available recipes on each tube
  • Process Limits - each tube has different process limits - see this page for requirements for each tube. Contact supervisor for advice on long (≥24hr) or high-temp processes.

Oxidation Rates & Data

See the above recipes page for data on oxidation rates for standard oxidation recipes.

Useful Information

Tystar Wafer Boat Drawing - 4" Wafer with 0.5mm Slots

See Also

Operational Instructions

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