RIE Etching Recipes: Difference between revisions
Jump to navigation
Jump to search
(moved RIE3 to Decomm'd tools page) |
|||
| (16 intermediate revisions by 3 users not shown) | |||
| Line 1: | Line 1: | ||
{{recipes|Dry Etching}} |
{{recipes|Dry Etching}} |
||
=[[RIE |
=[[RIE 2 (MRC)]]= |
||
=[[RIE 2 (MRC)]] = |
|||
==CdZnTe Etching (RIE 2)== |
==CdZnTe Etching (RIE 2)== |
||
*[ |
*[//wiki.nanotech.ucsb.edu/w/images/f/f5/11-CZT_etching-1.pdf CdZnTe Etch Recipes - CH<sub>4</sub>-H<sub>2</sub>-Ar] |
||
==ZnS Etching (RIE 2)== |
|||
*[//wiki.nanotech.ucsb.edu/w/images/b/b4/ZnS_Plasma_Etch-1.pdf ZnS Etch Recipe - CH<sub>4</sub>-H<sub>2</sub>-Ar] |
|||
==ITO Etching (RIE 2)== |
|||
| ⚫ | |||
==InP-InGaAsP-InGaAlAs Etching (RIE 2)== |
==InP-InGaAsP-InGaAlAs Etching (RIE 2)== |
||
| ⚫ | |||
*[//wiki.nanotech.ucsb.edu/w/images/6/6f/RIE2-InGaAs-InP-InAlAs-Etch-Plasma-RIE-RevA.pdf InP-InGaAsP-InAlGaAs Etch Recipes - CH<sub>4</sub>-H<sub>2</sub>-Ar] |
|||
=[[RIE 3 (MRC)]] = |
|||
=[[RIE 5 (PlasmaTherm)]] |
=[[RIE 5 (PlasmaTherm)]]= |
||
==AlGaAs Etching (RIE 5)== |
==AlGaAs\GaAs Etching (RIE 5)== |
||
*[ |
*[//wiki.nanotech.ucsb.edu/w/images/b/b5/13-GaAs-AlGaAs_Etching-RIE-5.pdf GaAs\AlGaAs Etch Recipes - BCl<sub>3</sub>-SiCl<sub>4</sub>] |
||
==GaN Etching (RIE 5)== |
==GaN Etching (RIE 5)== |
||
*[ |
*[//wiki.nanotech.ucsb.edu/w/images/c/cb/08-Plasma_Etching_of_GaN-RIE5.pdf GaN Etch Recipes - Cl<sub>2</sub>-BCl<sub>3</sub>-Ar] |
||
==Photoresist and ARC (RIE 5)== |
|||
===DUV42P (AR2) etching=== |
|||
*O2 = 20sccm // Pressure = 10mT // RF = 100W // Time = 40 sec |
|||
*No need to pump/purge, can etch right away. |
|||
*No helium cooling, Run in manual mode. |
|||
Latest revision as of 22:37, 6 August 2024
Back to Dry Etching Recipes.
RIE 2 (MRC)
CdZnTe Etching (RIE 2)
ZnS Etching (RIE 2)
ITO Etching (RIE 2)
InP-InGaAsP-InGaAlAs Etching (RIE 2)
RIE 5 (PlasmaTherm)
AlGaAs\GaAs Etching (RIE 5)
GaN Etching (RIE 5)
Photoresist and ARC (RIE 5)
DUV42P (AR2) etching
- O2 = 20sccm // Pressure = 10mT // RF = 100W // Time = 40 sec
- No need to pump/purge, can etch right away.
- No helium cooling, Run in manual mode.