Thermal Evap 2 (Solder): Difference between revisions

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{{tool|{{PAGENAME}}
{{tool2|{{PAGENAME}}
|picture=Thermal2.jpg
|picture=Thermal2.jpg
|type = Vacuum Deposition
|type = Vacuum Deposition
|super= Brian Lingg
|super= Michael Barreraz
|super2= Don Freeborn
|location=Bay 3
|location=Bay 3
|description = ?
|description = ?
Line 10: Line 11:
}}
}}


= About =
== About ==
Thermal evaporator #2 is the designated "Solder" evaporator. The tool is used primarily for solder materials including Gold, Indium and Tin. See the Recipes section below for other materials used.
write something...


Use this tool for materials with low melting temperatures, or for materials that have a high risk of contamination in the e-beam evaporators.
= Detailed Specifications =
work on this page...


== Detailed Specifications ==
=Documentation=
Wafers up to 12" can be mounted.
*[[ media: Thermal Evaporator2.pdf|Operating Instructions]]


==Documentation==
= Materials Table =
*[//wiki.nanotech.ucsb.edu/w/images/b/b3/Thermal_Evaporator2.pdf Operating Instructions]


== Recipes ==
{| border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%" class="collapsible collapsed wikitable"
* [[Thermal Evaporation Recipes#Thermal Evaporator 2|Recipes > Thermal Evaporation Recipes > Thermal Evaporator 2]]
|-
** ''Visit this page for the materials table and evaporation parameters for all materials available.''
! colspan=6 width=1300 height=35 bgcolor="#D0E7FF" align="center"|<div style="font-size: 150%;">Materials Table</div>
|- bgcolor="#D0E7FF"
! width="45" bgcolor="#D0E7FF" align="center" | '''Material'''
! width="45" bgcolor="#D0E7FF" align="center" | '''Symbol'''
! width="45" bgcolor="#D0E7FF" align="center" | '''Density, g/cm3'''
! width="45" bgcolor="#D0E7FF" align="center" | '''Z Ratio'''
! width="45" bgcolor="#D0E7FF" align="center" | '''Tooling, %'''
! width="100" bgcolor="#D0E7FF" align="center" | '''Comments'''
|-
|Aluminum
|Al
|2.70
|1.08
|
|
|-
|Antimony
|Sb
|6.620
|0.768
|
|
|-
|Arsenic
|As
|5.73
|0.996
|
|
|-
|Beryllium
|Be
|1.85
|0.543
|
|
|-
|Boron
|B
|2.54
|0.389
|
|
|-
|Cadmium
|Cd
|8.64
|0.682
|
|
|-
|Cadmium sulfide
|CdS
|4.83
|1.02
|
|
|-
|Cadmium telluride
|CdTe
|5.85
|0.980
|
|
|-
|Calcium fluoride
|CaF<sub>2</sub>
|3.18
|0.775
|
|Used often
|-
|Carbon (graphite)
|C
|2.25
|3.26
|
|
|-
|Chromium
|Cr
|7.20
|0.305
|155
|Used often
|-
|Cobalt
|Co
|8.71
|0.343
|
|
|-
|Copper
|Cu
|8.93
|0.437
|
|
|-
|Gallium
|Ga
|5.93
|0.593
|
|
|-
|Gallium Arsenide
|GaAs
|5.31
|1.59
|
|
|-
|Germanium
|Ge
|5.35
|0.516
|
|
|-
|Gold
|Au
|19.30
|0.381
|
|Used often
|-
|Indium
|In
|7.30
|0.841
|120
|Used often
|-
|Indium antimonide
|InSb
|5.76
|0.769
|
|
|-
|Iridium
|Ir
|22.4
|0.129
|
|
|-
|Iron
|Fe
|7.86
|0.349
|
|
|-
|Lead
|Pb
|11.3
|1.13
|
|
|-
|Lead sulfide
|PbS
|7.50
|0.566
|
|
|-
|Lithium fluoride
|LiF
|2.638
|0.778
|
|
|-
|Magnesium
|Mg
|1.74
|1.61
|
|
|-
|Magnesium oxide
|MgO
|3.58
|0.411
|
|
|-
|Magnesium Fluoride
|MgF<sub>2</sub>
|3.00 ( should be 3.18)
|0.427( should be 0.637)
|
|
|-
|Manganese
|Mn
|7.20
|0.377
|
|
|-
|Manganese(II) Sulfide
|MnS
|3.99
|0.94
|
|
|-
|Mercury
|Hg
|13.46
|0.74
|
|
|-
|Molybdenum
|Mo
|10.2
|0.257
|
|
|-
|Nickel
|Ni
|8.91
|0.331
|
|Used often
|-
|Niobium
|Nb
|8.578
|0.492
|
|
|-
|Niobium(V) Oxide
|Nb<sub>2</sub>O<sub>5</sub>
|4.47
|*1.00
|
|*z ratio has not been established
|-
|Palladium
|Pd
|12.0
|0.357
|
|
|-
|Platinum
|Pt
|21.4
|0.245
|
|
|-
|Potasium Cloride
|KCl
|1.98
|2.05
|
|
|-
|Selenium
|Se
|4.82
|0.864
|
|
|-
|Silicon
|Si
|2.32
|0.712
|
|
|-
|Silicon(II) Oxide
|SiO
|2.13
|0.87
|
|
|-
|Silicon dioxide (fused quarz)
|SiO<sub>2</sub>
|2.20
|1.07
|
|
|-
|Silver
|Ag
|10.5
|0.529
|
|
|-
|Silver bromide
|AgBr
|6.47
|1.18
|
|
|-
|Silver chloride
|AgCl
|5.56
|1.32
|
|
|-
|Sodium
|Na
|0.97
|4.8
|
|
|-
|Sodium chloride
|NaCl
|2.17
|1.57
|
|
|-
|Tantalum
|Ta
|16.6
|0.262
|
|
|-
|Tantalum(IV) oxide
|Ta<sub>2</sub>O<sub>5</sub>
|8.2
|0.30
|
|
|-
|Tin
|Sn
|7.30
|0.724
|
|Used often
|-
|Titanium
|Ti
|4.50
|0.628
|
|Used often
|-
|Titanium (IV) Oxide
|TiO<sub>2</sub>
|4.26
|0.40
|
|
|-
|Titanium Oxide
|TiO
|4.90
|*1.00
|
|* z ratio not established
|-
|Tungsten
|W
|19.3
|0.163
|
|
|-
|Tungsten carbide
|WC
|15.6
|0.151
|
|
|-
|Zinc
|Zn
|7.04
|0.514
|
|Used often
|-
|Zinc Oxide
|ZnO
|5.61
|0.556
|
|
|-
|Zinc Sulfide
|ZnS
|4.09
|0.775
|
|
|-
|Zirconium
|Zr
|6.51
|0.60
|
|Should be 6.49
|-
|Zirconium Oxide
|ZrO<sub>2</sub>
|5.6
|1.001
|
|
|-

Latest revision as of 17:29, 30 August 2022

Thermal Evap 2 (Solder)
Thermal2.jpg
Location Bay 3
Tool Type Vacuum Deposition
Manufacturer Custom
Description ?
Primary Supervisor Michael Barreraz
(805) 893-4147
mikebarreraz@ece.ucsb.edu

Secondary Supervisor

Don Freeborn

Recipes Vacuum Deposition Recipes
SignupMonkey: Sign up for this tool


About

Thermal evaporator #2 is the designated "Solder" evaporator. The tool is used primarily for solder materials including Gold, Indium and Tin. See the Recipes section below for other materials used.

Use this tool for materials with low melting temperatures, or for materials that have a high risk of contamination in the e-beam evaporators.

Detailed Specifications

Wafers up to 12" can be mounted.

Documentation

Recipes

Retrieved from "https://wiki.nanofab.ucsb.edu/w/index.php?title=Thermal_Evap_2_(Solder)&oldid=160318"