PECVD1 Recipes: Difference between revisions

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*[[media:PECVD1-SiON-standard recipe 2014.pdf|SiON Standard Recipe]]
*[[media:PECVD1-SiON-standard recipe 2014.pdf|SiO<sub>x</sub>N<sub>y</sub> Standard Recipe]]
*[https://docs.google.com/spreadsheet/ccc?key=0AnwBU1s4JQo2dEw0bjFEdTF2SUhRa25Ca0d0SzBha3c&usp=drive_web#gid=sharing SiO<sub>2</sub> Data September 2014]
*[https://docs.google.com/spreadsheet/ccc?key=0AnwBU1s4JQo2dEw0bjFEdTF2SUhRa25Ca0d0SzBha3c&usp=drive_web#gid=sharing SiO<sub>2</sub> Data September 2014]
*[https://docs.google.com/spreadsheet/ccc?key=0AnwBU1s4JQo2dEttR2JSTkRoamR0SUZ4bE5QUW9uS2c&usp=sharing SiO<sub>2</sub> 1000A Thickness uniformity 2014]
*[https://docs.google.com/spreadsheet/ccc?key=0AnwBU1s4JQo2dEttR2JSTkRoamR0SUZ4bE5QUW9uS2c&usp=sharing SiO<sub>2</sub> 1000A Thickness uniformity 2014]

Revision as of 18:30, 16 September 2014

PECVD 1 (PlasmaTherm 790)

SiN deposition (PECVD #1)

  • Deposition rate~11.30nm/min (users must calibrate this prior to critical deps)
  • HF e.r.~90nm/min
  • Stress~444MPa
  • Refractive Index~1.940

SiO2 deposition (PECVD #1)

  • Deposition rate~35.22nm/min (users must calibrate this prior to critical deps)
  • HF e.r.~646nm/min
  • Stress~-407MPa
  • Refractive Index~1.460

SiOxNy deposition (PECVD #1)


  • Deposition rate~35.22nm/min (users must calibrate this prior to critical deps)
  • HF e.r.~646nm/min
  • Stress~-407MPa
  • Refractive Index~1.460