PECVD1 Recipes: Difference between revisions
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*[https://docs.google.com/spreadsheet/ccc?key=0AnwBU1s4JQo2dEttR2JSTkRoamR0SUZ4bE5QUW9uS2c&usp=sharing SiO<sub>x</sub>N<sub>y</sub> 3000A Thickness uniformity 2014] |
*[https://docs.google.com/spreadsheet/ccc?key=0AnwBU1s4JQo2dEttR2JSTkRoamR0SUZ4bE5QUW9uS2c&usp=sharing SiO<sub>x</sub>N<sub>y</sub> 3000A Thickness uniformity 2014] |
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*Deposition rate~ |
*Deposition rate~14.50nm/min (users must calibrate this prior to critical deps) |
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*HF e.r.~ |
*HF e.r.~399nm/min |
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*Stress~ |
*Stress~145MPa |
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*Refractive Index~1. |
*Refractive Index~1.714 |
||
Revision as of 18:32, 16 September 2014
PECVD 1 (PlasmaTherm 790)
SiN deposition (PECVD #1)
- SiN Standard Recipe
- SiN Data September 2014
- SiN 1000A Thickness uniformity 2014
- Low Stress Si3N4 - Variable Stress Recipes
- Low Stress Si3N4 - Variable Stress Plot
- Deposition rate~11.30nm/min (users must calibrate this prior to critical deps)
- HF e.r.~90nm/min
- Stress~444MPa
- Refractive Index~1.940
SiO2 deposition (PECVD #1)
- Deposition rate~35.22nm/min (users must calibrate this prior to critical deps)
- HF e.r.~646nm/min
- Stress~-407MPa
- Refractive Index~1.460
SiOxNy deposition (PECVD #1)
- Deposition rate~14.50nm/min (users must calibrate this prior to critical deps)
- HF e.r.~399nm/min
- Stress~145MPa
- Refractive Index~1.714