PECVD1 Recipes: Difference between revisions
Jump to navigation
Jump to search
| Line 8: | Line 8: | ||
* [[media:PECVD1-SiON-Recipe.pdf|Low Stress Si<sub>3</sub>N<sub>4</sub> - Variable Stress Plot]] |
* [[media:PECVD1-SiON-Recipe.pdf|Low Stress Si<sub>3</sub>N<sub>4</sub> - Variable Stress Plot]] |
||
*Deposition rate~11. |
*Deposition rate~11.21nm/min (users must calibrate this prior to critical deps) |
||
*HF e.r.~89nm/min |
*HF e.r.~89nm/min |
||
*Stress~ |
*Stress~447MPa |
||
*Refractive Index~1.942 |
*Refractive Index~1.942 |
||
Revision as of 16:47, 10 December 2014
PECVD 1 (PlasmaTherm 790)
SiN deposition (PECVD #1)
- SiN Standard Recipe
- SiN Data December 2014
- SiN 1000A Thickness uniformity 2014
- Low Stress Si3N4 - Variable Stress Recipes
- Low Stress Si3N4 - Variable Stress Plot
- Deposition rate~11.21nm/min (users must calibrate this prior to critical deps)
- HF e.r.~89nm/min
- Stress~447MPa
- Refractive Index~1.942
SiO2 deposition (PECVD #1)
- Deposition rate~35.52nm/min (users must calibrate this prior to critical deps)
- HF e.r.~645nm/min
- Stress~-408MPa
- Refractive Index~1.461
LS SiOxNy deposition (PECVD #1)
- SiOxNy Deposition Recipes - Varying N/O Ratio
- SiOxNy Stress/Index vs. O/N Ratio
- SiOxNy Recipe
- SiOxNy Data December 2014
- SiOxNy 3000A Thickness uniformity 2014