OLD - PECVD2 Recipes: Difference between revisions
Jump to navigation
Jump to search
| Line 6: | Line 6: | ||
== SiN deposition (PECVD #2) == |
== SiN deposition (PECVD #2) == |
||
*[[media: |
*[[media:NewAdvPECVD-Nitride2 300C standard recipe.pdf|Nitride2 Standard Recipe]] |
||
*[https://docs.google.com/spreadsheet/ccc?key=0AnwBU1s4JQo2dDE0R3FlenNPa2txNmRldTczMXZNNnc#gid=sharing Nitride2 Data 2014] |
*[https://docs.google.com/spreadsheet/ccc?key=0AnwBU1s4JQo2dDE0R3FlenNPa2txNmRldTczMXZNNnc#gid=sharing Nitride2 Data 2014] |
||
*[https://docs.google.com/spreadsheet/ccc?key=0AnwBU1s4JQo2dERkYm85bGtYQVpjVk5GTGJuMkg2anc&usp=drive_web#gid=sharing Nitride2 Thickness uniformity 2014] |
*[https://docs.google.com/spreadsheet/ccc?key=0AnwBU1s4JQo2dERkYm85bGtYQVpjVk5GTGJuMkg2anc&usp=drive_web#gid=sharing Nitride2 Thickness uniformity 2014] |
||
Revision as of 19:01, 11 December 2014
PECVD 2 (Advanced Vacuum)
Photos
SiN deposition (PECVD #2)
SiO2 deposition (PECVD #2)
LS SiN deposition (PECVD #2)
- Deposition Rate: ≈ 7.87 nm/min (users must calibrate this prior to critical deps)
- Refractive Index: ≈ 1.938
- Stress ≈ 1.76MPa
- HF etch rate~47nm/min