Dry Etching Recipes: Difference between revisions

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| width="65" bgcolor="#DAF1FF" | [[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> (MRC)]]
| width="65" bgcolor="#DAF1FF" | [[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> (MRC)]]
| width="100" bgcolor="#DAF1FF" | [[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br>(PlasmaTherm)]]
| width="100" bgcolor="#DAF1FF" | [[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br>(PlasmaTherm)]]
| width="100" bgcolor="#DAF1FF" | [[ICP_Etching_Recipes#DSEIII.28PlasmaTherm.2FBosch_Etch.29|DSEIII<br>(PlasmaTherm)]]
| width="100" bgcolor="#DAF1FF" | [[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br>(PlasmaTherm)]]
| width="100" bgcolor="#DAF1FF" | [[ICP_Etching_Recipes#Si_Deep_RIE_.28PlasmaTherm.2FBosch_Etch.29|Si Deep RIE<br>(PTI/Bosch)]]
| width="100" bgcolor="#DAF1FF" | [[ICP_Etching_Recipes#Si_Deep_RIE_.28PlasmaTherm.2FBosch_Etch.29|Si Deep RIE<br>(PTI/Bosch)]]
| width="120" bgcolor="#DAF1FF" | [[ICP_Etching_Recipes#ICP_Etch_1_.28Panasonic_E626I.29|ICP Etch 1<br>(Panasonic 1)]]
| width="120" bgcolor="#DAF1FF" | [[ICP_Etching_Recipes#ICP_Etch_1_.28Panasonic_E626I.29|ICP Etch 1<br>(Panasonic 1)]]

Revision as of 22:18, 6 November 2017

  • R = Recipe is available. Clicking this link will take you to the recipe.
  • A = Material is available for use, but no recipes are provided.
Dry Etching Recipes
RIE Etching ICP Etching Oxygen Plasma Systems Other Dry Etchers
Material RIE 1
(Retired)
RIE 2
(MRC)
RIE 3
(MRC)
RIE 5
(PlasmaTherm)
DSEIII
(PlasmaTherm)
Si Deep RIE
(PTI/Bosch)
ICP Etch 1
(Panasonic 1)
ICP Etch 2
(Panasonic 2)
ICP-Etch
(Unaxis VLR)
Ashers
(Technics PEII)
Plasma Clean
(Gasonics 2000)
UV Ozone Reactor Plasma Activation
(EVG 810)
XeF2 Etch
(Xetch)
Vapor HF Etch
(uETCH)
CAIBE
(Oxford)
Ag
Al A R1 R1
Au R1
Cr A R1 A
Cu
Ge
Mo
Ni R1
Pt R1
Ru
Si R1 R1
Ta
Ti R1 A
Al2O3
Al2O3 (Sapphire) R1 A
AlGaAs R1 R1 GaAs-AlGaAs Etch (Unaxis VLR)
AlGaN R1
AlN R1
CdZnTe R1
GaAs R1 R1 R1 GaAs-AlGaAs Etch (Unaxis VLR)
GaN GaN Etch (RIE 5) R1 R1
GaSb A GaSb Etch Unaxis VLR)
HfO2
InGaAlAs InP-InGaAsP-InGaAlAs Etching (RIE 2) InP-InGaAs-InAlAs Etch (Unaxis VLR)
InGaAsP InP-InGaAsP-InGaAlAs Etching (RIE 2) InP-InGaAs-InAlAs Etch (Unaxis VLR)
InP InP-InGaAsP-InGaAlAs Etching (RIE 2) A A InP-InGaAs-InAlAs Etch (Unaxis VLR)
ITO R1
SiC R1 A
SiN SiNx Etching (RIE 3) R1 R1
SiO2 SiO2 Etching (RIE 3) R1 R1 R1
SiOxNy
Ta2O5 A
TiN
TiO2
W-TiW R1 A
ZnO2
ZnS R1
ZnSe R1
ZrO2
Material RIE 1
(Retired)
RIE 2
(MRC)
RIE 3
(MRC)
RIE 5
(PlasmaTherm)
Si Deep RIE
(PlasmaTherm/Bosch Etch)
ICP Etch 1
(Panasonic E626I)
ICP Etch 2
(Panasonic E640)
ICP-Etch
(Unaxis VLR)
Ashers
(Technics PEII)
Plasma Clean
(Gasonics 2000)
UV Ozone Reactor Plasma Activation
(EVG 810)
XeF2 Etch
(Xetch)
Vapor HF Etch
(uETCH)
CAIBE
(Oxford)