Surface Analysis (KLA/Tencor Surfscan): Difference between revisions
Jump to navigation
Jump to search
(Text replacement - "[//wiki" to "[https://wiki") |
|||
| Line 18: | Line 18: | ||
**''For detailed measurement info, it is highly recommended that you read the manual.'' |
**''For detailed measurement info, it is highly recommended that you read the manual.'' |
||
*[[Wafer scanning process traveler]] |
*[[Wafer scanning process traveler]] |
||
*[[Surfscan photo]] |
|||
Revision as of 17:01, 7 April 2020
|
About
This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. It can scan wafers in size from 4 to 8 inches.
Documentation
- Standard Operating Procedure
- Operations Manual
- For detailed measurement info, it is highly recommended that you read the manual.
- Wafer scanning process traveler