Wafer Coating Process Traveler: Difference between revisions
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There are three standard recipes : STD SiO2, STD Nitride2, and STD LS Nitride2 at 300C. Instructions bellow explain how to run each of the recipes ( seasoning, deposition, cleaning) |
There are three standard recipes : STD SiO2, STD Nitride2, and STD LS Nitride2 at 300C. Instructions bellow explain how to run each of the recipes ( seasoning, deposition, cleaning) |
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=== Standard Oxide Deposition === |
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==== STD SiO2 ==== |
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#Log in to Advanced PECVD #2 |
#Log in to Advanced PECVD #2 |
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#Seasoning |
#Seasoning |
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#*Load the cleaning recipe (CH4/O2 clean). Edit the recipe and enter required time for cleaning. |
#*Load the cleaning recipe (CH4/O2 clean). Edit the recipe and enter required time for cleaning. |
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#*Log out |
#*Log out |
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=== Standard Nitride Deposition === |
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==== STD Nitride2 ==== |
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=== Standard Low Stress Deposition === |
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==== STD LS Nitride2 ==== |
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Revision as of 23:48, 22 April 2020
There are three standard recipes : STD SiO2, STD Nitride2, and STD LS Nitride2 at 300C. Instructions bellow explain how to run each of the recipes ( seasoning, deposition, cleaning)
Standard Oxide Deposition
STD SiO2
- Log in to Advanced PECVD #2
- Seasoning
- Load the seasoning recipe (STD SiO2), and run it. The goal of this step is to coat oxide on chamber walls and prepare it for deposition.
- Deposition
- Vent the chamber and load the substrate (place it in the center of platen). You can place small pieces around the wafer to protect it from moving.
- Pump down.
- Load the deposition recipe (SiN@250C), and run it. Deposition time is variable. Get the rate from historical data.
- Unload the wafer.
- Cleaning
- Wipe sidewall first with DI water, followed by IPA.
- Load the cleaning recipe (CH4/O2 clean). Edit the recipe and enter required time for cleaning.
- Log out