Direct-Write Lithography Recipes: Difference between revisions
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General notes: Hotplates used, filters, laser wavelengths, etc. |
General notes: Hotplates used, filters, laser wavelengths, etc. |
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{| class="wikitable" border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center;" |
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|- bgcolor="#D0E7FF" |
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! width="100" |Resist |
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! width="100" |Spin Cond. |
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! width="75" |Bake |
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! width="75" |Thickness |
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! width="125" |Exposure Time |
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! width="100" |Focus Offset |
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! width="75" |PEB |
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! width="100" |Developer |
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! width="125" |Developer Time |
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! width="300" |Comments |
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|SPR955CM0.9 |
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|3 krpm/30” |
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|95°C/60” |
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|~ 0.9 um |
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|AZ300MIF |
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| align="left" | |
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*?? |
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*{{fl|SPR955CMstepperrecipe.pdf|See SPR955CM data file}} |
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== Negative Resist (MLA150) == |
== Negative Resist (MLA150) == |
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General notes: Hotplates used, filters, laser wavelengths, etc. |
General notes: Hotplates used, filters, laser wavelengths, etc. |
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{| class="wikitable" border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center;" |
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|- bgcolor="#D0E7FF" |
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! width="100" |Resist |
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! width="100" |Spin Cond. |
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! width="75" |Bake |
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! width="75" |Thickness |
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! width="125" |Exposure Time |
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! width="100" |Focus Offset |
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! width="75" |PEB |
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! width="75" |Flood |
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! width="100" |Developer |
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! width="125" |Developer Time |
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! width="300" |Comments |
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|AZ5214 |
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|6 krpm/30” |
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|95°C/60” |
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|~ 1.0 um |
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|60" |
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|AZ300MIF |
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|60" |
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| align="left" | |
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*??? |
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Revision as of 05:24, 14 September 2020
Back to Lithography Recipes.
Work In Progress This article is still under construction. It may contain factual errors. Content is subject to change. |
Photolithography Recipes for the Heidelberg MLA150 will go here.
Positive Resist (MLA150)
General notes: Hotplates used, filters, laser wavelengths, etc.
Resist | Spin Cond. | Bake | Thickness | Exposure Time | Focus Offset | PEB | Developer | Developer Time | Comments |
---|---|---|---|---|---|---|---|---|---|
SPR955CM0.9 | 3 krpm/30” | 95°C/60” | ~ 0.9 um | AZ300MIF |
Negative Resist (MLA150)
General notes: Hotplates used, filters, laser wavelengths, etc.
Resist | Spin Cond. | Bake | Thickness | Exposure Time | Focus Offset | PEB | Flood | Developer | Developer Time | Comments |
---|---|---|---|---|---|---|---|---|---|---|
AZ5214 | 6 krpm/30” | 95°C/60” | ~ 1.0 um | 60" | AZ300MIF | 60" |
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