Direct-Write Lithography Recipes: Difference between revisions

Revision as of 21:58, 9 October 2020

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Photolithography Recipes for the Heidelberg MLA150. Description of litho params- different lasers available, greyscale etc.

General notes: Hotplates used, filters, laser wavelengths, etc.

Resist	Spin Cond.	Bake	Thickness	Laser (nm)	Exposure Time\|	DeFocus	PEB	Developer	Developer Time	Comments
AZ4110	4 krpm/30s	95°C/60s	~ 1.1 µm	405	240	5	none	AZ400K:DI 1:4	50s	Used MLA design (good for isolated lines 0.8-1um)
AZ4330	4 krpm/30s	95°C/60s	~ 3.3 µm	405	320	6	none	AZ400K:DI 1:4	90s	Used MLA design
AZ4620
SPR 220-3.0	2.5 krpm/30s	115°C/90”	~ 2.7 µm	405			115°C/90s	AZ300MIF	60s
SPR 955-CM0.9	3 krpm/30s	95°C/90”	~ 0.9 µm	405	250	- 7	110°C/90s	AZ300MIF	60s
THMR-3600HP

General notes: Hotplates used, filters, laser wavelengths, etc.

Resist	Spin Cond.	Bake	Thickness	Laser (nm)	Flood	Developer	Developer Time	Comments
AZ5214	6 krpm/30s	95°C/60s	~ 1.0 µm	405	60"	AZ300MIF	60s	???
AZnLOF2020	3 krpm/30s	110°C/90s	~ 2.1µm	405	none	AZ300MIF	60s
SU-8 2075			~70µm	375				Extremely viscous. Pour into a wide-mouthed bottle, dispense directly from bottle. Replace napkin at end.

Description...

Resist	Spin Cond.	Bake	Thickness	Exposure Time	Focus Offset	PEB	Flood	Developer	Developer Time	Comments
AZ4620Z5214	?? krpm/30”	95°C/60”	?? µm				60"	AZ300MIF	60"	???

@@ Line 75: / Line 75: @@
 |[[:File:SPR955-Positive-Resist-Datasheet.pdf|SPR 955-CM0.9]]
 |3 krpm/30s
-|95°C/60”
+|95°C/90”
 |~ 0.9 µm
 |405
 |250
 | - 7
-|110°C/60s
+|110°C/90s
 |AZ300MIF
 |60s
 | align="left" |
 |-
 |[[:File:3600 D, D2v Spin Speed Curve.pdf|THMR-3600HP]]
 |