Dry Etching Recipes: Difference between revisions
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|[[ICP Etching Recipes#GaAs Etch .28Panasonic 2.29|R3]] |
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|[[ICP Etching Recipes#GaAs Etch .28Oxford ICP Etcher.29| |
|[[ICP Etching Recipes#GaAs Etch .28Oxford ICP Etcher.29|R2]] |
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Revision as of 22:31, 4 October 2024
Process Control Data
See above linked page for process control data (dep rate/stress etc. over time), for a selection of often-used dry etches
Dry Etching Tools/Materials Table
The Key/Legend for this table's A...R6 values is at the bottom of the page.
Process Ranking Table
Processes in the table above are ranked by their "Process Maturity Level" as follows:
| Process Level | Description of Process Level Ranking | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| A | Process Allowed and materials available but never done | ||||||||||
| R1 | Process has been run at least once | ||||||||||
| R2 | Process has been run and/or procedure is documented or/and data available | ||||||||||
| R3 | Process has been run, procedure is documented, and data is available | ||||||||||
| R4 | Process has a documented procedure with regular (≥4x per year) data or lookahead/in-situ control available | ||||||||||
| R5 | Process has a documented procedure with regular (≥4x per year) data and lookahead/in-situ control available | ||||||||||
| R6 | Process has a documented procedure, regular ( ≥4x per year) data, and control charts & limits available | ||||||||||