Thermal Evap 2 (Solder): Difference between revisions
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*[https://wiki.nanofab.ucsb.edu/w/images/1/17/Thermal_Evaporator2-Normal_Fixture-_Indium_Deposition.pdf Using Normal Fixture] |
*[https://wiki.nanofab.ucsb.edu/w/images/1/17/Thermal_Evaporator2-Normal_Fixture-_Indium_Deposition.pdf Using Normal Fixture] |
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*[https://wiki.nanofab.ucsb.edu/w/images/d/d1/Thermal_Evaprator2-Cold_Fixture-Indium_Deposition.pdf Using Cold Fixture] |
*[https://wiki.nanofab.ucsb.edu/w/images/d/d1/Thermal_Evaprator2-Cold_Fixture-Indium_Deposition.pdf Using Cold Fixture] |
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*[https://wiki.nanofab.ucsb.edu/w/images/7/74/Thermal_Evap_2_pump_down_procedure-New-_5-29-25.pdf Temp Pump Down SOP as of 5-29-25] |
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== Recipes == |
== Recipes == |
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Revision as of 16:29, 29 May 2025
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About
Thermal evaporator #2 is the designated "Solder" evaporator. The tool is used primarily for solder materials including Gold, Indium and Tin. See the Recipes section below for other materials used.
Use this tool for materials with low melting temperatures, or for materials that have a high risk of contamination in the e-beam evaporators.
Detailed Specifications
Wafers up to 12" can be mounted.
Documentation
Recipes
- Recipes > Thermal Evaporation Recipes > Thermal Evaporator 2
- Visit this page for the materials table and evaporation parameters for all materials available.
