Dry Etching Recipes: Difference between revisions
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|[[ICP Etching Recipes# |
|[[ICP Etching Recipes#High Rate Bosch Etch (DSEIII)|R6]], [[ICP Etching Recipes#Analogous FICP Recipes (DSEiii)|R3]] |
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|[[ICP Etching Recipes#Si Etch Recipes (Fluorine ICP Etcher)|R6]] |
|[[ICP Etching Recipes#Si Etch Recipes (Fluorine ICP Etcher)|R6]] |
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Latest revision as of 01:16, 10 February 2026
Process Control Data
See above linked page for process control data (dep rate/stress etc. over time), for a selection of often-used dry etches
Dry Etching Tools/Materials Table
Process Maturity Ranking
R6- most mature process with regular calibrations recorded on SPC charts.- …
R1- least mature - only run once ever.
The Key/Legend for this table's A...R6 values is at the bottom of the page.
Process Ranking Table
Processes in the table above are ranked by their "Process Maturity Level" as follows:
| Process Level | Description of Process Level Ranking | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| A | Process Allowed and materials available but never done | ||||||||||
| R1 | Process has been ran at least once | ||||||||||
| R2 | Process has been ran and procedure is documented | ||||||||||
| R3 | Process has been ran, procedure is documented, and data is available | ||||||||||
| R4 | Process has a documented procedure with regular (≥4x per year) data no in-Situ control available | ||||||||||
| R5 | Process has a documented procedure with regular (≥4x per year) data and in-Situ control available | ||||||||||
| R6 | Process has a documented procedure and control charts/limits available. Controlled process. | ||||||||||