PECVD 2 (Advanced Vacuum): Difference between revisions
Jump to navigation
Jump to search
Line 19: | Line 19: | ||
=Documentation= |
=Documentation= |
||
*[[media:Advanced PECVD 2-Operating-Manual.pdf|Operating Instruction Manual]] |
*[[media:Advanced PECVD 2-Operating-Manual for Adv. PECVD 2.pdf|Operating Instruction Manual for Advanced PECVD 2]] |
||
*[[Advanced PECVD 2 Standard recipes.pdf|Advanced PECVD 2 Standard Recipes]] |
*[[Advanced PECVD 2 Standard recipes.pdf|Advanced PECVD 2 Standard Recipes]] |
||
*[[Advanced PECVD 2 Data-particles, thickness, index.pdf|Advanced PECVD 2 Data-particles, thickness, index]] |
*[[Advanced PECVD 2 Data-particles, thickness, index.pdf|Advanced PECVD 2 Data-particles, thickness, index]] |
Revision as of 18:31, 14 August 2012
|
About
This open-load system is dedicated to PECVD of SiO2, SiNx, SiOxNy, and a-Si using Silane (2%SiH4, 98% He), N2O, NH3, and N2 gases. The sample electrode has a 270mm diameter useable area, allowing for multiple 4” wafer depositions in a single run. Standard operating temperature is 300C, but can be user changed for temps ranging anywhere from 250 to 350C. The system is equipped with a dual generator, dual frequency option for growth of low-stress Nitride films.