Dry Etching Recipes: Difference between revisions

Content deleted Content added

Inline

Revision as of 16:38, 18 September 2012

R = Recipe is available. Clicking this link will take you to the recipe.

Dry Etching Recipes
	RIE Etching				ICP Etching				Oxygen Plasma Systems				Other Dry Etchers
Material	RIE 1 (Custom)	RIE 2 (MRC)	RIE 3 (MRC)	RIE 5 (PlasmaTherm)	Si Deep RIE (PlasmaTherm/Bosch Etch)	ICP Etch 1 (Panasonic E626I)	ICP Etch 2 (Panasonic E640)	ICP-Etch (Unaxis VLR)	Ashers (Technics PEII)	Plasma Clean (Gasonics 2000)	UV Ozone Reactor	Plasma Activation (EVG 810)	XeF2 Etch (Xetch)
Al
Ti
Cr
Ge
Ag
Ru
Mo
Ta
W
Al₂O₃
HfO₂
ITo
SiO₂
SiN
SiOxNy
Ta₂O₅
TiO₂
TiN
ZnO₂
ZrO₂
GaAs
AlGaAs
InGaAlAs
InGaAsP
InP								R1
GaN
AlGaN
AlN
GaN
AlGaN
AlN
GaSb
CdTe
ZnSe
Si
SiC
Sapphire
Material	RIE 1 (Custom)	RIE 2 (MRC)	RIE 3 (MRC)	RIE 5 (PlasmaTherm)	Si Deep RIE (PlasmaTherm/Bosch Etch)	ICP Etch 1 (Panasonic E626I)	ICP Etch 2 (Panasonic E640)	ICP-Etch (Unaxis VLR)	Ashers (Technics PEII)	Plasma Clean (Gasonics 2000)	UV Ozone Reactor	Plasma Activation (EVG 810)	XeF2 Etch (Xetch)

@@ Line 1: / Line 1: @@
+{{Recipe Table Explanation}}
 {| border="1" class="wikitable" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%"
 |- bgcolor="#D0E7FF"