Thermal Evap 2 (Solder): Difference between revisions

From UCSB Nanofab Wiki
Jump to navigation Jump to search
Line 11: Line 11:


= About =
= About =

=Detailed Specifications=
*Standard 18" bell jar pumped by 8" Varian cryopump (HV8) driven by Ebara 2.1 compressor
*Low E-7 Torr ultimate pressure
*Rate Monitor: Maxtek TM-300
*Typical material rates: Al - 1 A/s @ 85 amps
**Au - 5 A/s @ 122 amps
**Cr - 2 A/s @ 85 amps
**Zn - 4.5 A/s @ 50 amps


= Materials Table =
= Materials Table =

Revision as of 23:08, 28 August 2012

Thermal Evap 2 (Solder)
Thermal2.jpg
Tool Type Vacuum Deposition
Location Bay 3
Supervisor Brian Lingg
Supervisor Phone (805) 893-8145
Supervisor E-Mail lingg_b@ucsb.edu
Description ?
Manufacturer Custom
Vacuum Deposition Recipes
Sign up for this tool



About

Materials Table