Thermal Evap 2 (Solder): Difference between revisions

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Line 50: Line 50:
|1.85
|1.85
|0.543
|0.543
|
|
|-
|Boron
|B
|2.54
|0.389
|
|
|-
|Cadmium
|Cd
|8.64
|0.682
|
|
|-
|Cadmium sulfide
|CdS
|4.83
|1.02
|
|
|-
|Cadmium telluride
|CdTe
|5.85
|0.980
|
|
|
|

Revision as of 23:20, 28 August 2012

Thermal Evap 2 (Solder)
Thermal2.jpg
Tool Type Vacuum Deposition
Location Bay 3
Supervisor Brian Lingg
Supervisor Phone (805) 893-8145
Supervisor E-Mail lingg_b@ucsb.edu
Description ?
Manufacturer Custom
Vacuum Deposition Recipes
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