Sputtering Recipes: Difference between revisions

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=[[Sputter 2 (SFI Endeavor)]]=
=[[Sputter 2 (SFI Endeavor)]]=
== Al Deposition (Sputter 2) ==
== Al Deposition (Sputter 2) ==
*[[media:|Al Deposition Recipe]]
*[[media:20-Al-Sputtering-Film-Sputter-2.pdf|Al Deposition Recipe]]
== AlN<sub>x</sub> Deposition (Sputter 2) ==
== AlN<sub>x</sub> Deposition (Sputter 2) ==
*[[media:19-AlN-Sputtering-Film-Sputter-2.pdf|AlN<sub>x</sub> Deposition Recipe]]
*[[media:19-AlN-Sputtering-Film-Sputter-2.pdf|AlN<sub>x</sub> Deposition Recipe]]

Revision as of 16:19, 7 October 2013

Back to Vacuum Deposition Recipes.

Sputter 1 (Custom)

Sputter 2 (SFI Endeavor)

Al Deposition (Sputter 2)

AlNx Deposition (Sputter 2)

Sputter 3 (AJA ATC 2000-F)

Sputter 4 (AJA ATC 2200-V)

Sputter 5 (Lesker AXXIS)

Ion Beam Deposition (Veeco NEXUS)

IBD Calibrations Spreadsheet - Records of historical film depositions (rates, indices), Uniformity etc.

All users are required to enter their calibration deps (simple test deps only)


SiO2 deposition (IBD)

  • Refractive Index: ≈1.485
  • Rate: ≈6.1nm/min (users must calibrate this prior to critical deps)
  • Stress ≈ -320MPa (compressive)

Si3N4 deposition (IBD)

  • Refractive Index ≈ 2.01
  • Rate ≈ 4.5nm/min (users must calibrate this prior to critical deps)
  • Stress ≈ -1756MPa (compressive)

Ta2O5 deposition (IBD)

  • Refractive Index ≈ 2.10
  • Rate ≈7.8nm/min (users must calibrate this prior to critical deps)
  • Stress ≈ -140MPa (compressive)

TiO2 deposition (IBD)