OLD - PECVD2 Recipes: Difference between revisions
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*[https://docs.google.com/spreadsheet/ccc?key=0AnwBU1s4JQo2dERkYm85bGtYQVpjVk5GTGJuMkg2anc&usp=drive_web#gid=sharing Nitride2 Thickness uniformity 2014] |
*[https://docs.google.com/spreadsheet/ccc?key=0AnwBU1s4JQo2dERkYm85bGtYQVpjVk5GTGJuMkg2anc&usp=drive_web#gid=sharing Nitride2 Thickness uniformity 2014] |
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*Deposition Rate: ≈ 8. |
*Deposition Rate: ≈ 8.17 nm/min (users must calibrate this prior to critical deps) |
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*Refractive Index: ≈ 1. |
*Refractive Index: ≈ 1.957 |
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*Stress ≈ |
*Stress ≈ 499MPa |
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*HF etch rate:~ |
*HF etch rate:~49nm/min |
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== SiO<sub>2</sub> deposition (PECVD #2) == |
== SiO<sub>2</sub> deposition (PECVD #2) == |
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Revision as of 22:57, 1 August 2014
PECVD 2 (Advanced Vacuum)
SiN deposition (PECVD #2)
- Deposition Rate: ≈ 8.17 nm/min (users must calibrate this prior to critical deps)
- Refractive Index: ≈ 1.957
- Stress ≈ 499MPa
- HF etch rate:~49nm/min
SiO2 deposition (PECVD #2)
- Deposition Rate: ≈ 28.36 nm/min (users must calibrate this prior to critical deps)
- Refractive Index: ≈ 1.473
- Stress ≈ -256MPa
- HF etch rate~582nm/min
LS SiN deposition (PECVD #2)
- Deposition Rate: ≈ 8.17 nm/min (users must calibrate this prior to critical deps)
- Refractive Index: ≈ 1.935
- Stress ≈ -0.04MPa
- HF etch rate~47nm/min