PECVD1 Recipes: Difference between revisions

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== SiO<sub>2</sub> deposition (PECVD #1) ==
== SiO<sub>2</sub> deposition (PECVD #1) ==
*[[media:PECVD1-SiO2-standard recipe 2014.pdf|SiO<sub>2</sub> Standard Recipe]]
*[[media:PECVD1-SiO2-standard recipe 2014.pdf|SiO<sub>2</sub> Standard Recipe]]
*[https://docs.google.com/spreadsheet/ccc?key=0AnwBU1s4JQo2dEw0bjFEdTF2SUhRa25Ca0d0SzBha3c&usp=drive_web#gid=sharing SiO<sub>2</sub> Data June 2014]
*[https://docs.google.com/spreadsheet/ccc?key=0AnwBU1s4JQo2dEw0bjFEdTF2SUhRa25Ca0d0SzBha3c&usp=drive_web#gid=sharing SiO<sub>2</sub> Data July 2014]
*[https://docs.google.com/spreadsheet/ccc?key=0AnwBU1s4JQo2dEttR2JSTkRoamR0SUZ4bE5QUW9uS2c&usp=sharing SiO<sub>2</sub> 1000A Thickness uniformity 2014]
*[https://docs.google.com/spreadsheet/ccc?key=0AnwBU1s4JQo2dEttR2JSTkRoamR0SUZ4bE5QUW9uS2c&usp=sharing SiO<sub>2</sub> 1000A Thickness uniformity 2014]



Revision as of 22:51, 1 August 2014

PECVD 1 (PlasmaTherm 790)

SiN deposition (PECVD #1)

  • Deposition rate~11.21nm/min (users must calibrate this prior to critical deps)
  • HF e.r.~87nm/min
  • Stress~476MPa
  • Refractive Index~1.936

SiO2 deposition (PECVD #1)

  • Deposition rate~35.73nm/min (users must calibrate this prior to critical deps)
  • HF e.r.~610nm/min
  • Stress~-402MPa
  • Refractive Index~1.460

SiOxNy deposition (PECVD #1)