Tool List: Difference between revisions

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__NOTOC__
__NOTOC__
=Lithography=
=Lithography=
{|
|-valign="top"
|width=200|
* [[Suss Aligners]]
* [[Suss Aligners]]
* [[IR Aligner]]
* [[IR Aligner]]
* [[DUV Flood Expose]]
* [[DUV Flood Expose]]
* [[Ovens]]
* [[Ovens]]
|width=200|
* [[Stepper 1]]
* [[Stepper 1]]
* [[Stepper 2]]
* [[Stepper 2]]
* [[Stepper 3]]
* [[Stepper 3]]
* [[E-Beam Lithography System]]
* [[E-Beam Lithography System]]
|-
|}


=Vacuum Deposition=
=Vacuum Deposition=
{|
|-valign="top"
|width=200|
* [[E-Beam 1]]
* [[E-Beam 1]]
* [[E-Beam 2]]
* [[E-Beam 2]]
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* [[Sputter 3]]
* [[Sputter 3]]
* [[Sputter 4]]
* [[Sputter 4]]
|width=200|
* [[Sputter 5]]
* [[Sputter 5]]
* [[PECVD 1]]
* [[PECVD 1]]
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* [[Molecular Vapor Deposition]]
* [[Molecular Vapor Deposition]]
* [[Atomic Layer Deposision]]
* [[Atomic Layer Deposision]]
|-

|}
=Dry Etch=
=Dry Etch=
{|
|-valign="top"
|width=200|
* [[RIE 1]]
* [[RIE 1]]
* [[RIE 2]]
* [[RIE 2]]
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* [[Ashers]]
* [[Ashers]]
* [[VLR Etch]]
* [[VLR Etch]]
|width=200|
* [[ICP Etch 1]]
* [[ICP Etch 1]]
* [[ICP Etch 2]]
* [[ICP Etch 2]]
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* [[XeF2 Etch]]
* [[XeF2 Etch]]
* [[Plasma Activation Tool]]
* [[Plasma Activation Tool]]
|-
|}


=Wet Processing=
=Wet Processing=

Revision as of 22:09, 27 June 2012

Lithography

Vacuum Deposition

Dry Etch

Wet Processing

Thermal Processing

Packaging

Inspection, Test and Characterization

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