PECVD1 Recipes: Difference between revisions

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*Refractive Index~1.461
*Refractive Index~1.461


== SiO<sub>x</sub>N<sub>y</sub> deposition (PECVD #1) ==
== LS SiO<sub>x</sub>N<sub>y</sub> deposition (PECVD #1) ==
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*[[media:PECVD1-SiON-Recipe.pdf|SiO<sub>x</sub>N<sub>y</sub> Deposition Recipes - Varying N/O Ratio]]
*[[media:PECVD1-SiON-Recipe.pdf|SiO<sub>x</sub>N<sub>y</sub> Deposition Recipes - Varying N/O Ratio]]

Revision as of 23:44, 5 December 2014

PECVD 1 (PlasmaTherm 790)

SiN deposition (PECVD #1)

  • Deposition rate~11.23nm/min (users must calibrate this prior to critical deps)
  • HF e.r.~89nm/min
  • Stress~450MPa
  • Refractive Index~1.942

SiO2 deposition (PECVD #1)

  • Deposition rate~35.52nm/min (users must calibrate this prior to critical deps)
  • HF e.r.~645nm/min
  • Stress~-408MPa
  • Refractive Index~1.461

LS SiOxNy deposition (PECVD #1)

  • Deposition rate~14.99nm/min (users must calibrate this prior to critical deps)
  • HF e.r.~417nm/min
  • Stress~133MPa
  • Refractive Index~1.714

LS SiN deposition (PECVD #1)

  • Deposition rate~14.99nm/min (users must calibrate this prior to critical deps)
  • HF e.r.~417nm/min
  • Stress~133MPa
  • Refractive Index~1.714