Template:Announcements: Difference between revisions

From UCSB Nanofab Wiki
Jump to navigation Jump to search
Content deleted Content added
added GCA AutoStep
RIE5 software upgrade
Line 8: Line 8:
<!---------------------------------------------->
<!---------------------------------------------->
<!------------- Announcements ---------------->
<!------------- Announcements ---------------->

===== RIE#5: Software Upgrades =====
[[RIE_5_(PlasmaTherm)|RIE#5]] Will be down next week from approximately Monday Sept. 17th to Thursday Sept. 20th, for a software upgrade to the same software running on the other PlasmaTherm tools.
All users will need to be retrained after the upgrade is complete.
// [[User:John d|John d]] 15:16, 11 September 2018 (PDT)


===== Deep-UV uScope Operational =====
===== Deep-UV uScope Operational =====

Revision as of 22:16, 11 September 2018

UCSB NanoFab Announcements

RIE#5: Software Upgrades

RIE#5 Will be down next week from approximately Monday Sept. 17th to Thursday Sept. 20th, for a software upgrade to the same software running on the other PlasmaTherm tools. All users will need to be retrained after the upgrade is complete. // John d 15:16, 11 September 2018 (PDT)

Deep-UV uScope Operational

The DUV Microscope is now repaired and operational. // John d 23:49, 30 August 2018 (PDT)

GCA Stepper Maintenance

The GCA 6300 will be down 09/12/18 thru 09/13/18 from 8:00 am until 6:30 pm both days for service. The GCA Autostep will be down from 09/10/18 thru 09/11/2018 from 8:00 am to 6:30 pm both days for service. The systems will be available for your use both days after 6:30 pm. Please schedule your process accordingly. // John d 15:19, 29 August 2018 (PDT)

PECVD#1: Software Upgrade

Plasmatherm will be upgrading the system software on September 17th. The upgrade will take 3-5 days. After the upgrade is complete, everyone must be re-certified to use the tool. Please document any custom recipes that you may have, in case they can't be copied over. // John d 06:38, 15 August 2018 (PDT)

RIE#5: SiCl4 Issue

We have a flow rate problem on the SiCl4 gas line. You can only flow the SiCl4 for 5 minutes and then you have to wait 5 minutes before you flow it again. So in order to to do a 10 minute Etch you will have to do it in three steps flow 5 mi, wait 5mi, then flow 5min. // John d 17:22, 15 June 2018 (PDT)