Mike Silva: Difference between revisions
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|position = Senior Development Engineer |
|position = Senior Development Engineer |
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|room = 1109B |
|room = 1109B |
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|phone = (805) 839- |
|phone = (805) 839-3096 |
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|cell = (805) |
|cell = (805) 450-2263 |
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|email = silva@ece.ucsb.edu |
|email = silva@ece.ucsb.edu |
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}} |
}} |
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|-valign="top" |
|-valign="top" |
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*[[DUV Flood Expose]] |
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*[[High Temp Oven (Blue M)]] |
*[[High Temp Oven (Blue M)]] |
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*[[Sputter 5 (Lesker AXXIS)]] |
*[[Sputter 5 (Lesker AXXIS)]] |
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*[[PECVD 2 (Advanced Vacuum)]] |
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*[[Thermal Evap 1]] |
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*[[Ion Beam Deposition (Veeco NEXUS)]] |
*[[Ion Beam Deposition (Veeco NEXUS)]] |
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*[[ICP Etch 2 (Panasonic E640)]] |
*[[ICP Etch 2 (Panasonic E640)]] |
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*[[HF Vapor Etch]] |
*[[HF Vapor Etch]] |
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* [[Tube Furnace Wafer Bonding (Thermco)]] |
* [[Tube Furnace Wafer Bonding (Thermco)]] |
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* [[Step Profile (Dektak IIA)]] |
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* [[Step Profilometer (Dektak 6M)]] |
* [[Step Profilometer (Dektak 6M)]] |
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* [[Ellipsometer (Rudolph)]] |
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* [[Film Stress (Tencor Flexus)]] |
* [[Film Stress (Tencor Flexus)]] |
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* [[Optical Film Thickness (Nanometric)]] |
* [[Optical Film Thickness (Nanometric)]] |
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Revision as of 16:43, 25 April 2019
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About
Information to come.
Current Work
Information to come.
Tools
Mike Silva is in charge of the following tools: