Dry Etching Recipes: Difference between revisions

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(minor edit)
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{| class="wikitable" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%" border="1"
{| class="wikitable" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%" border="1"
|- bgcolor="#d0e7ff"
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! colspan="18" width="725" height="45" |<div style="font-size: 150%;">Dry Etching Recipes</div>
! colspan="17" width="725" height="45" |<div style="font-size: 150%;">Dry Etching Recipes</div>
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|<!-- INTENTIONALLY LEFT BLANK -->
|<!-- INTENTIONALLY LEFT BLANK -->
! colspan="4" width="300" height="35" align="center" bgcolor="#d0e7ff" |'''[[RIE Etching Recipes|RIE Etching]]'''
! colspan="3" |'''[[RIE Etching Recipes|RIE Etching]]'''
! colspan="5" |'''[[ICP Etching Recipes|ICP Etching]]'''
! colspan="5" |'''[[ICP Etching Recipes|ICP Etching]]'''
! colspan="5" align="center" bgcolor="#d0e7ff" |'''[[Oxygen Plasma System Recipes|Oxygen Plasma Systems]]'''
! colspan="5" align="center" bgcolor="#d0e7ff" |'''[[Oxygen Plasma System Recipes|Oxygen Plasma Systems]]'''
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! width="65" align="center" bgcolor="#d0e7ff" |'''Material'''
! width="65" align="center" bgcolor="#d0e7ff" |'''Material'''
| width="65" bgcolor="#daf1ff" |[[RIE 1 (Custom)|RIE 1<br>(Retired)]]
| width="65" bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> (MRC)]]
| width="65" bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> (MRC)]]
| width="65" bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> (MRC)]]
| width="65" bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> (MRC)]]
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! align="center" bgcolor="#d0e7ff" |Al<sub>2</sub>O<sub>3</sub>
! align="center" bgcolor="#d0e7ff" |Al<sub>2</sub>O<sub>3</sub>
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! align="center" bgcolor="#d0e7ff" |Al<sub>2</sub>O<sub>3 (Sapphire)</sub>
! align="center" bgcolor="#d0e7ff" |Al<sub>2</sub>O<sub>3 (Sapphire)</sub>
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! align="center" bgcolor="#d0e7ff" |CdZnTe
! align="center" bgcolor="#d0e7ff" |CdZnTe
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|{{rl|RIE Etching Recipes|CdZnTe Etch (RIE 2)}}
|{{rl|RIE Etching Recipes|CdZnTe Etch (RIE 2)}}
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! align="center" bgcolor="#d0e7ff" |HfO<sub>2</sub>
! align="center" bgcolor="#d0e7ff" |HfO<sub>2</sub>
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! align="center" bgcolor="#d0e7ff" |InGaAlAs
! align="center" bgcolor="#d0e7ff" |InGaAlAs
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|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
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! align="center" bgcolor="#d0e7ff" |InGaAsP
! align="center" bgcolor="#d0e7ff" |InGaAsP
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|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
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! align="center" bgcolor="#d0e7ff" |InP
! align="center" bgcolor="#d0e7ff" |InP
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|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
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! align="center" bgcolor="#d0e7ff" |ITO
! align="center" bgcolor="#d0e7ff" |ITO
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|{{rl|RIE Etching Recipes|ITO Etch (RIE 2)}}
|{{rl|RIE Etching Recipes|ITO Etch (RIE 2)}}
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!Photoresist
!Photoresist
& ARC
& ARC
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|A
|A
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! align="center" bgcolor="#d0e7ff" |SiN
! align="center" bgcolor="#d0e7ff" |SiN
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|{{rl|RIE Etching Recipes|RIE 3 (MRC)|SiN<sub>x</sub> Etching (RIE 3)}}
|{{rl|RIE Etching Recipes|RIE 3 (MRC)|SiN<sub>x</sub> Etching (RIE 3)}}
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! align="center" bgcolor="#d0e7ff" |SiO<sub>2</sub>
! align="center" bgcolor="#d0e7ff" |SiO<sub>2</sub>
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|{{rl|RIE Etching Recipes|RIE 3 (MRC)|SiO<sub>2</sub> Etching (RIE 3)}}
|{{rl|RIE Etching Recipes|RIE 3 (MRC)|SiO<sub>2</sub> Etching (RIE 3)}}
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! align="center" bgcolor="#d0e7ff" |Ta<sub>2</sub>O<sub>5</sub>
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! align="center" bgcolor="#d0e7ff" |ZnO<sub>2</sub>
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! align="center" bgcolor="#d0e7ff" |ZnS
! align="center" bgcolor="#d0e7ff" |ZnS
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|{{rl|RIE Etching Recipes|ZnS Etching (RIE 2)}}
|{{rl|RIE Etching Recipes|ZnS Etching (RIE 2)}}
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|{{rl|RIE Etching Recipes|ZnS Etching (RIE 2)}}
|{{rl|RIE Etching Recipes|ZnS Etching (RIE 2)}}
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! align="center" bgcolor="#d0e7ff" |ZrO<sub>2</sub>
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! align="center" bgcolor="#d0e7ff" |'''Material'''
! align="center" bgcolor="#d0e7ff" |'''Material'''
| bgcolor="#daf1ff" |[[RIE 1 (Custom)|RIE 1<br>(Retired)]]
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> (MRC)]]
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> (MRC)]]
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> (MRC)]]
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> (MRC)]]

Revision as of 04:27, 17 September 2019

  • R = Recipe is available. Clicking this link will take you to the recipe.
  • A = Material is available for use, but no recipes are provided.
Dry Etching Recipes
RIE Etching ICP Etching Oxygen Plasma Systems Other Dry Etchers
Material RIE 2
(MRC) 		RIE 3
(MRC) 		RIE 5
(PlasmaTherm) 		DSEIII
(PlasmaTherm) 		SLR Fluorine ICP (PlasmaTherm) ICP Etch 1
(Panasonic 1) 		ICP Etch 2
(Panasonic 2) 		ICP-Etch
(Unaxis VLR) 		Ashers
(Technics PEII) 		Plasma Clean
(Gasonics 2000) 		Plasma Clean (YES EcoClean) UV Ozone Reactor Plasma Activation
(EVG 810) 		XeF2 Etch
(Xetch) 		Vapor HF Etch
(uETCH) 		CAIBE
(Oxford)
Ag A
Al A R1 R1 A
Au R
Cr A R1 A A
Cu A
Ge A A
Mo A
Ni R1
Pt R1
Ru A R1 A
Si R1 R1 R1 A
Ta A
Ti R1 A A
Al2O3 R A
Al2O3 (Sapphire) R1 A A
AlGaAs R1 R1 GaAs-AlGaAs Etch (Unaxis VLR) A
AlGaN R1 A
AlN R1 A
CdZnTe R1 A
GaAs R1 R1 R1 GaAs-AlGaAs Etch (Unaxis VLR) A
GaN R1 R1 R1 A
GaSb A GaSb Etch Unaxis VLR) A
HfO2 A
InGaAlAs InP-InGaAsP-InGaAlAs Etching (RIE 2) InP-InGaAs-InAlAs Etch (Unaxis VLR) A
InGaAsP InP-InGaAsP-InGaAlAs Etching (RIE 2) InP-InGaAs-InAlAs Etch (Unaxis VLR) A
InP InP-InGaAsP-InGaAlAs Etching (RIE 2) A A InP-InGaAs-InAlAs Etch (Unaxis VLR) A
ITO R1 A
Photoresist

& ARC

A R R R A A A A
SiC R1 A A
SiN SiNx Etching (RIE 3) R1 R1 A A
SiO2 SiO2 Etching (RIE 3) A R1 R1 R1 A
SiOxNy A A A
Ta2O5 A A
TiN A
TiO2 A
W-TiW R1 A A
ZnO2 A
ZnS R1 A
ZnSe R1 A
ZrO2 A
Material RIE 2
(MRC) 		RIE 3
(MRC) 		RIE 5
(PlasmaTherm) 		DSEIII
(PlasmaTherm) 		SLR Fluorine ICP (PlasmaTherm) ICP Etch 1
(Panasonic E626I) 		ICP Etch 2
(Panasonic E640) 		ICP-Etch
(Unaxis VLR) 		Ashers
(Technics PEII) 		Plasma Clean
(Gasonics 2000) 		Plasma Clean (YES EcoClean) UV Ozone Reactor Plasma Activation
(EVG 810) 		XeF2 Etch
(Xetch) 		Vapor HF Etch
(uETCH) 		CAIBE
(Oxford)
Retrieved from "https://wiki.nanofab.ucsb.edu/w/index.php?title=Dry_Etching_Recipes&oldid=156775"