Surface Analysis (KLA/Tencor Surfscan): Difference between revisions
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**''For detailed measurement info, it is highly recommended that you read the manual.'' |
**''For detailed measurement info, it is highly recommended that you read the manual.'' |
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*[[Wafer scanning process traveler]] |
*[[Wafer scanning process traveler]] |
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*[[UCSBTEST2.jpg]] |
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Revision as of 16:32, 1 April 2020
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About
This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. It can scan wafers in size from 4 to 8 inches.
Documentation
- Standard Operating Procedure
- Operations Manual
- For detailed measurement info, it is highly recommended that you read the manual.
- Wafer scanning process traveler
- UCSBTEST2.jpg