Direct-Write Lithography Recipes: Difference between revisions

Revision as of 23:37, 9 October 2020

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Photolithography Recipes for the Heidelberg MLA150. Description of litho params- different lasers available, greyscale etc.

General notes: Hotplates used, filters, laser wavelengths, etc.

Resist	Spin Cond.	Bake	Thickness	Laser (nm)	Exposure Time\|	DeFocus	PEB	Developer	Developer Time	Comments
AZ4110	4 krpm/30s	95°C/60s	~ 1.1 µm	405	240	5	none	AZ400K:DI 1:4	50s	Used MLA design (good for isolated lines 0.8-1um)
AZ4330	4 krpm/30s	95°C/60s	~ 3.3 µm	405	320	6	none	AZ400K:DI 1:4	90s	Used MLA design
AZ4620
SPR 220-3.0	2.5 krpm/30s	115°C/90”	~ 2.7 µm	405	325	- 4	115°C/90s	AZ300MIF	60s	Used MLA design
SPR 955-CM0.9	3 krpm/30s	95°C/90”	~ 0.9 µm	405	250	- 7	110°C/90s	AZ300MIF	60s	Used MLA design
THMR-3600HP

General notes: Hotplates used, filters, laser wavelengths, etc.

Resist	Spin Cond.	Bake	Thickness	Laser (nm)	Exposure Time	DeFocus	PEB	Flood	Developer	Developer Time	Comments
AZ5214	6 krpm/30s	95°C/60s	~ 1.0 µm	375	35	- 5	Used UCSB design. Good for up to ~1.3um open line space.	60"	AZ300MIF	60s	???
AZnLOF2020	4 krpm/30s	110°C/60s	~ 2.1µm	375	340	- 3	110°C/60s	none	AZ300MIF	90s	Used UCSB design. Good for 2um open line space.
SU-8 2075			~70µm	375							Extremely viscous. Pour into a wide-mouthed bottle, dispense directly from bottle. Replace napkin at end.

Description...

Resist	Spin Cond.	Bake	Thickness	Exposure Time	Focus Offset	PEB	Flood	Developer	Developer Time	Comments
AZ4620Z5214	?? krpm/30”	95°C/60”	?? µm				60"	AZ300MIF	60"	???

@@ Line 121: / Line 121: @@
 |~ 1.0 µm
 |375
-|
+|35
+| - 5
-|
+|Used UCSB design. Good for up to ~1.3um open line space.
-|
 |60"
 |AZ300MIF
@@ Line 141: / Line 141: @@
 |AZ300MIF
 |90s
-|Used UCSB design. Good for 2um feature size.
+|Used UCSB design. Good for 2um open line space.
 |-
 |[[:File:SU-8-2075-revA.pdf|SU-8 2075]]