Wafer Cleaver (PELCO Flip-Scribe): Difference between revisions
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|location=ESB 1106? |
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|description = Manual Cleaving |
|description = Manual Cleaving |
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|model = [https://www.tedpella.com/Material-Sciences_html/PELCO-FlipScribe.aspx PELCO Flip-Scribe] |
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|model = LatticeAx |
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|manufacturer = [https://www.tedpella.com TedPella Inc.] |
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Revision as of 16:43, 1 March 2022
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About
The LatticeAx is a manual cleaving system, with a diamond tip that scribes along the underside of the part/wafer. The user manually drags the part across the diamond scribe, using the guides and stops to push the part in a controlled, straight line. Manual breaking tools are provided to perform the break after scribing.
Detailed Specifications
- Wafer/Parts Sizes: 4" down to ~10mm
Operating Procedures
- LatticeAx SOP - To be added
Recipes
- Recipes > Packaging > To Be Added
Be sure to also see the recipes for protecting your sample from dicing dust on the Packaging Recipes page.