Automated Wafer Cleaver (Loomis LSD-155LT): Difference between revisions

From UCSB Nanofab Wiki
Jump to navigation Jump to search
(initial page)
 
Line 12: Line 12:
}}
}}
==About==
==About==
The Loomis LSD-155Lt is a production scribe and break system that can be used for processing large grids, arrays of laser bars, cleaving high quality mirror facets, and dicing wafers.
TBD: Insert info general here.


==Detailed Specifications==
==Detailed Specifications==


*Maximum Wafer Size:
*Maximum Wafer Size: 4"
*Parts mounted to UV-release tape for cutting
*Parts mounted to low tack tape and used in conjunction with 6" plastic rings.
*Automated cut maps at multiple angles (0° and 90° typical)
*Automated cut maps at multiple angles (0° and 90° typical)
*~few micron alignment to on-wafer features.
*~few micron alignment to on-wafer features.
* TBD
*TBD


==Operating Procedures==
==Operating Procedures==
Line 29: Line 29:


*Recipes > Packaging > '''Wafer Cleaver Recipes (LSD-155LT)'''
*Recipes > Packaging > '''Wafer Cleaver Recipes (LSD-155LT)'''
* Wafer thinning is critical, see the Wafer Lapping (Allied XYZ) tool as well.
*Wafer thinning is critical, see the Wafer Lapping (Allied XYZ) tool as well.

Revision as of 14:59, 16 May 2023

Automated Wafer Cleaver (Loomis LSD-155LT)
File:LoomisLSD155lt.jpg
Location Backend Lab: ESB 1111
Tool Type Packaging
Manufacturer Loomis Industries Inc.
Model LSD-155LT
Description Loomis Automated Wafer Cleaver
Primary Supervisor Aidan Hopkins
(805) 893-2343
hopkins@ece.ucsb.edu
Materials III-V's, thin Silicon
Recipes


About

The Loomis LSD-155Lt is a production scribe and break system that can be used for processing large grids, arrays of laser bars, cleaving high quality mirror facets, and dicing wafers.

Detailed Specifications

  • Maximum Wafer Size: 4"
  • Parts mounted to low tack tape and used in conjunction with 6" plastic rings.
  • Automated cut maps at multiple angles (0° and 90° typical)
  • ~few micron alignment to on-wafer features.
  • TBD

Operating Procedures

Recipes

  • Recipes > Packaging > Wafer Cleaver Recipes (LSD-155LT)
  • Wafer thinning is critical, see the Wafer Lapping (Allied XYZ) tool as well.
Retrieved from "https://wiki.nanofab.ucsb.edu/w/index.php?title=Automated_Wafer_Cleaver_(Loomis_LSD-155LT)&oldid=161104"