Dry Etching Recipes: Difference between revisions
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|[https://wiki.nanotech.ucsb.edu/wiki/ICP_Etching_Recipes#Photoresist_and_ARC_Etching_.28Panasonic_1.29 R] |
|[https://wiki.nanotech.ucsb.edu/wiki/ICP_Etching_Recipes#Photoresist_and_ARC_Etching_.28Panasonic_1.29 R] |
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|[https://wiki.nanotech.ucsb.edu/wiki/ICP_Etching_Recipes#Photoresist_and_ARC_etching_.28Panasonic_2.29 R] |
|[https://wiki.nanotech.ucsb.edu/wiki/ICP_Etching_Recipes#Photoresist_and_ARC_etching_.28Panasonic_2.29 R] |
Revision as of 22:46, 19 July 2024
Process Control Data
See linked page for process control data (dep rate/stress etc. over time), for a selection of often-used thin-film depositions.
Dry Etching Tools/Materials Table
Process Ranking Table
Process Level | Description of Process Level Ranking | ||||||||||
A | Process allowed and materials available but never done | ||||||||||
R1 | Process has been ran at least once | ||||||||||
R2 | Process has been ran and/or procedure is documented or/and data available | ||||||||||
R3 | Process has been ran, procedure is documented, and data is available | ||||||||||
R4 | Process has a documented procedure with regular (≥4x per year) data or lookahead/in-Situ control available | ||||||||||
R5 | Process has a documented procedure with regular (≥4x per year) data and lookahead/in-Situ control available | ||||||||||
R6 | Process has a documented procedure, regular ( ≥4x per year) data, and control charts/limits available |