Template:Announcements: Difference between revisions

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=====Wafer Bonder=====
=====JEOL JBX-6300FS=====
JEOL have applied a temporary fix that after overnite testing has shown to be robust. A full fix will require new boards to arrive from Japan in about a week.
The issues still remain but the investigation is pointing to a couple of boards in an external control computer. JEOL service are running a test overnight to try isolate the issue. Hopefully more will be known in the morning.
So feel confident about using the tool in the interim. If any issues, let me know immediately.// [[User:John_d|Demis D. John]] 15:52, 6 August 2024 (PDT)


=====Wafer Bonder, (Suss SB6-8E)=====
System down for now...
//[[User:Mehalana v|Vraj Mehalana]] 13:34, 6 August 2024 (PDT)
An engineer will be here the week of Aug. 26th to begin repairs on the tool. // [[User:John_d|Demis D. John]] 15:52, 6 August 2024 (PDT)


=====Unaxis ICP-PECVD Update=====
=====Unaxis ICP-PECVD Update=====
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//[[User:Mehalana v|Vraj Mehalana]] 16:26, 26 July 2024 (PDT)
//[[User:Mehalana v|Vraj Mehalana]] 16:26, 26 July 2024 (PDT)

=====Dicing Saw Service Visit=====
The annual PM on the tool has been completed. However, there is still the issue with the chuck not rotating a perfect 90 degrees after aligning the first angle, so you will still have to perform alignment for angle #2. ADT is looking into sending us a cal plate to try and rectify this as the first potential solution.

-Lee

//[[User:Mehalana v|Vraj Mehalana]] 10:23, 8 July 2024 (PDT)

=====Velion FIB Tool DOWN=====
Raith service have completed the source change, resolved the power supply and column alignment issues, and restored the Pt deposition capability to full capacity. With remote assistance from Raith I will run some calibrations and stability tests over the next few days. After that I will return the tool to general use towards the end of the week.

The new ion source is AuGeSi. We have no plans to return to GaBiLi for the foreseeable future. Please get in contact if you have any questions.

-Dan

//[[User:Mehalana v|Vraj Mehalana]] 10:23, 8 July 2024 (PDT)


=====ICP1 Down=====
=====ICP1 Down=====
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//[[User:Mehalana v|Vraj Mehalana]] 16:59, 14 June 2024 (PDT)
//[[User:Mehalana v|Vraj Mehalana]] 16:59, 14 June 2024 (PDT)

=====Wafer Bonder, (Suss SB6-8E)=====
SUSS aims to be on site in early February. We’ll will send out an email once I get confirmation for a specific date.

//[[User:Mehalana v|Vraj Mehalana]] 14:23, 13 December 2023 (PST)


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Revision as of 22:52, 6 August 2024

JEOL JBX-6300FS

JEOL have applied a temporary fix that after overnite testing has shown to be robust. A full fix will require new boards to arrive from Japan in about a week. So feel confident about using the tool in the interim. If any issues, let me know immediately.// Demis D. John 15:52, 6 August 2024 (PDT)

Wafer Bonder, (Suss SB6-8E)

An engineer will be here the week of Aug. 26th to begin repairs on the tool. // Demis D. John 15:52, 6 August 2024 (PDT)

Unaxis ICP-PECVD Update

Unfortunately the shipment of repaired parts was significantly delayed. I will be installing them and testing on Tuesday. With any luck the system will be available Tuesday evening.

Tony

//Vraj Mehalana 16:26, 26 July 2024 (PDT)

ICP1 Down

The board we were waiting on arrived, but it did not resolve the tool issue. We are working with Panasonic on the next steps. //Vraj Mehalana 14:17, 1 March 2024 (PST)

Lab Access Changes: Symmetry App

The iris scanner has been decommissioned. Please use the card reader which supports:

-Physical card

-Mobile phone via Symmetry App

//Vraj Mehalana 16:59, 14 June 2024 (PDT)