Dry Etching Recipes

R3Process Control Data

See above linked page for process control data (dep rate/stress etc. over time), for a selection of often-used dry etches

Dry Etching Tools/Materials Table

The Key/Legend for this table's A...R6 values is at the bottom of the page.

Dry Etching Recipes
	RIE Etching		ICP Etching					Oxygen Plasma Systems				Other Dry Etchers
Material	RIE 2 (MRC)	RIE 5 (PlasmaTherm)	DSEIII (PlasmaTherm)	Fluorine ICP (PlasmaTherm)	ICP Etch 1 (Panasonic E646V)	ICP Etch 2 (Panasonic E626I)	Oxford ICP (PlasmaPro 100)	Ashers (Technics PEII)	Plasma Clean (YES EcoClean)	UV Ozone Reactor	Plasma Activation (EVG 810)	XeF2 Etch (Xetch)	Vapor HF Etch (uETCH)	CAIBE (Oxford)
Ag														R1
Al		R2			R1	R2								R1
Au														R4
Cr		R2			R1	R1								R1
Cu														R1
Ge					A	R1						R2		R1
Mo														R1
Nb					A	R1
Ni														R4
Os					A	R1
Pt														R4
Ru					A	R3								R1
Si			R4	R5			R1					R4		R1
Ta					A	R1								R1
Ti					R1	R1								R1
Al2O3					A	R3								R1
Al2O3 (Sapphire)					R1	R1								R1
AlGaAs		R3			R1		R3							R1
AlGaN							R2							R1
AlN														R1
BCB					A
CdZnTe	R3													R1
GaAs		R4			R1	R3	R3							R1
GaN		R4			R1	R1	R2							R1
GaSb					A	R1	R1							R1
HfO2														R1
InGaAlAs	R4						R1							R1
InGaAsP	R4						R3							R1
InP	R4				A	R1	R6							R4
ITO	R4													R1
LiNbO3														R1
Photoresist & ARC & Organics		R3		R3	R	R3		R3	R3	R3	R3			R1
SiC					R1	R1								R1
SiN				R3	R1	R3		R3						R1
SiO2				R6	R1	R6							R4	R1
SiOxNy					A	R1								R1
SU8					A
Ta2O5					A	R1								R1
TiN														R1
TiO2														R1
W-TiW				R2	R1	R1								R1
ZnO2														R1
ZnS	R3													R1
ZnSe	R2													R1
ZrO2														R1
Material	RIE 2 (MRC)	RIE 5 (PlasmaTherm)	DSEIII (PlasmaTherm)	Fluorine ICP (PlasmaTherm)	ICP Etch 1 (Panasonic E626I)	ICP Etch 2 (Panasonic E640)	Oxford ICP (PlasmaPro 100)	Ashers (Technics PEII)	Plasma Clean (YES EcoClean)	UV Ozone Reactor	Plasma Activation (EVG 810)	XeF2 Etch (Xetch)	Vapor HF Etch (uETCH)	CAIBE (Oxford)

Process Ranking Table

Processes in the table above are ranked by their "Process Maturity Level" as follows:

Process Level	Description of Process Level Ranking
A	Process Allowed and materials available but never done
R1	Process has been run at least once
R2	Process has been run and/or procedure is documented or/and data available
R3	Process has been run, procedure is documented, and data is available
R4	Process has a documented procedure with regular (≥4x per year) data or lookahead/in-situ control available
R5	Process has a documented procedure with regular (≥4x per year) data and lookahead/in-situ control available
R6	Process has a documented procedure, regular ( ≥4x per year) data, and control charts & limits available