Dry Etching Recipes: Difference between revisions

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Revision as of 23:00, 14 August 2024

See above linked page for process control data (dep rate/stress etc. over time), for a selection of often-used dry etches

The Key/Legend for this table's A...R6 values is at the bottom of the page.

Processes in the table above are ranked by their "Process Maturity Level" as follows:

Process Level	Description of Process Level Ranking
A	Process Allowed and materials available but never done
R1	Process has been run at least once
R2	Process has been run and/or procedure is documented or/and data available
R3	Process has been run, procedure is documented, and data is available
R4	Process has a documented procedure with regular (≥4x per year) data or lookahead/in-situ control available
R5	Process has a documented procedure with regular (≥4x per year) data and lookahead/in-situ control available
R6	Process has a documented procedure, regular ( ≥4x per year) data, and control charts & limits available

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 | bgcolor="#daf1ff" |[[ICP Etching Recipes#PlasmaTherm.2FSLR Fluorine Etcher|Fluorine ICP <span style="font-size: 88%;">(PlasmaTherm)</span>]]
 | bgcolor="#daf1ff" |[[ICP Etching Recipes#ICP Etch 1 .28Panasonic E646V.29|ICP Etch 1<br><span style="font-size: 88%;">(Panasonic  E646V)</span>]]
-| bgcolor="#daf1ff" |[[R3|ICP Etch 2<br><span style="font-size: 88%;">(Panasonic  E626I)</span>]]
+| bgcolor="#daf1ff" |[[ICP Etching Recipes#ICP Etch 2 .28Panasonic E626I.29|ICP Etch 2<br><span style="font-size: 88%;">(Panasonic  E626I)</span>]]
 | bgcolor="#daf1ff" |[[ICP Etching Recipes#Oxford ICP Etcher .28PlasmaPro 100 Cobra.29|Oxford ICP <span style="font-size: 88%;">(PlasmaPro 100)</span>]]
 | bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Ashers_.28Technics_PEII.29|Ashers<br><span style="font-size: 88%;">(Technics PEII)</span>]]
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-|[Https://www.osapublishing.org/optica/abstract.cfm%3Furi%3Doptica-4-5-532 R1]
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