Thermal Evap 2 (Solder): Difference between revisions

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|0.841
|0.841
|120
|120
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|Indium antimonide
|InSb
|5.76
|0.769
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|-
|Iridium
|Ir
|22.4
|0.129
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|Iron
|Fe
|7.86
|0.349
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Revision as of 23:35, 28 August 2012

Thermal Evap 2 (Solder)
Thermal2.jpg
Tool Type Vacuum Deposition
Location Bay 3
Supervisor Brian Lingg
Supervisor Phone (805) 893-8145
Supervisor E-Mail lingg_b@ucsb.edu
Description ?
Manufacturer Custom
Vacuum Deposition Recipes
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