Thermal Evap 2 (Solder): Difference between revisions

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Line 176: Line 176:
|11.3
|11.3
|1.13
|1.13
|
|
|-
|Lead sulfide
|PbS
|7.50
|0.566
|
|
|-
|Lithium fluoride
|LiF
|2.64
|0.774
|
|
|-
|Magnesium
|Mg
|1.74
|1.61
|
|
|-
|Magnesium oxide
|MgO
|3.58
|0.411
|
|
|-
|Manganese
|Mn
|7.20
|0.377
|
|
|
|

Revision as of 23:41, 28 August 2012

Thermal Evap 2 (Solder)
Thermal2.jpg
Tool Type Vacuum Deposition
Location Bay 3
Supervisor Brian Lingg
Supervisor Phone (805) 893-8145
Supervisor E-Mail lingg_b@ucsb.edu
Description ?
Manufacturer Custom
Vacuum Deposition Recipes
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