Thermal Evap 2 (Solder)

Thermal Evap 2 (Solder) Tool Type Vacuum Deposition Location Bay 3 Supervisor Brian Lingg Supervisor Phone (805) 893-8145 Supervisor E-Mail lingg_b@ucsb.edu Description ? Manufacturer Custom Vacuum Deposition Recipes Sign up for this tool

Materials Table

Materials Table
Material	Symbol	Density, g/cm3	Z Ratio	Tooling, %	Comments
Aluminum	Al	2.70	1.08
Antimony	Sb	2.70	0.768
Arsenic	As	5.73	0.996
Beryllium	Be	1.85	0.543
Boron	B	2.54	0.389
Cadmium	Cd	8.64	0.682
Cadmium sulfide	CdS	4.83	1.02
Cadmium telluride	CdTe	5.85	0.980
Calcium fluoride	CaF2	3.18	0.775
Carbon (graphite)	C	2.25	3.26
Chromium	Cr	7.20	0.305	155
Cobalt	Co	8.71	0.343
Copper	Cu	8.93	0.437
Gallium	Ga	5.93	0.593
Gallium Arsenide	GaAs	5.31	1.59
Germanium	Ge	5.35	0.516
Gold	Au	19.30	0.381
Indium	In	7.30	0.841	120
Indium antimonide	InSb	5.76	0.769
Iridium	Ir	22.4	0.129
Iron	Fe	7.86	0.349
Lead	Pb	11.3	1.13
Lead sulfide	PbS	7.50	0.566
Lithium fluoride	LiF	2.64	0.774
Magnesium	Mg	1.74	1.61
Magnesium oxide	MgO	3.58	0.411
Magnesium Fluoride	MgF2	3.00	0.427
Manganese	Mn	7.20	0.377
Manganese(II) Sulfide	MnS	3.99	0.94
Mercury	Hg	13.46	0.74
Molybdenum	Mo	10.2	0.257
Nickel	Ni	8.91	0.331
Niobium	Nb	8.57	0.493
Niobium(V) Oxide	Nb2O5	4.47
Palladium	Pd	12.0	0.357
Platinum	Pt	21.4	0.245
Potasium Cloride	KCl	1.98	2.05
Selenium	Se	4.82	0.864
Silicon	Si	2.32	0.712
Silicon(II) Oxide	SiO	2.13	0.87
Silicon dioxide (fused quarz)	SiO2	2.20	1.07