Stepper 3 (ASML DUV): Difference between revisions
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The ASML DUV stepper is a 248nm line stepper for imaging dense features down to below 200nm and isolated line structures down to below 150nm. The system is a variable NA system and has a field image size of 21 x 21mm for 0.63 NA and a field size of 22mm x 27mm for 0.4 to 0.57NA. Overlay accuracy is better than 30nm. The system is configured for 4” wafers and pieces down to 14mm in size can be exposed using a 4” wafer as a carrier. |
The ASML DUV stepper is a 248nm line stepper for imaging dense features down to below 200nm and isolated line structures down to below 150nm. The system is a variable NA system and has a field image size of 21 x 21mm for 0.63 NA and a field size of 22mm x 27mm for 0.4 to 0.57NA. Overlay accuracy is better than 30nm. The system is configured for 4” wafers and pieces down to 14mm in size can be exposed using a 4” wafer as a carrier. |
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= Process Information = |
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*[http://signupmonkey.ece.ucsb.edu/wiki/index.php/Lithography_Recipes Process Page] |
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=See Also= |
=See Also= |
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Revision as of 17:46, 1 April 2014
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About
The ASML DUV stepper is a 248nm line stepper for imaging dense features down to below 200nm and isolated line structures down to below 150nm. The system is a variable NA system and has a field image size of 21 x 21mm for 0.63 NA and a field size of 22mm x 27mm for 0.4 to 0.57NA. Overlay accuracy is better than 30nm. The system is configured for 4” wafers and pieces down to 14mm in size can be exposed using a 4” wafer as a carrier.