Dry Etching Recipes

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• A = Material is available for use, but no recipes are provided.

Dry Etching Recipes
	RIE Etching				ICP Etching				Oxygen Plasma Systems				Other Dry Etchers
Material	RIE 1 (Retired)	RIE 2 (MRC)	RIE 3 (MRC)	RIE 5 (PlasmaTherm)	Si Deep RIE (PTI/Bosch)	ICP Etch 1 (Panasonic 1)	ICP Etch 2 (Panasonic 2)	ICP-Etch (Unaxis VLR)	Ashers (Technics PEII)	Plasma Clean (Gasonics 2000)	UV Ozone Reactor	Plasma Activation (EVG 810)	XeF2 Etch (Xetch)	Vapor HF Etch (uETCH)	CAIBE (Oxford)
Ag
Al				A		R1	R1
Au															R1
Cr				A		R1	A
Cu
Ge
Ni															R1
Pt															R1
Ti						R1	A
Ru
Mo
Ta
W-TiW						R1	A
Al2O3
HfO2
ITO		R1
SiO2			SiO2 Etching (RIE 3)			R1	R1							R1
SiN			SiNx Etching (RIE 3)			R1	R1
SiOxNy
Ta2O5
TiO2
TiN
ZnO2
ZrO2
GaAs				R1		R1	R1	GaAs-AlGaAs Etch (Unaxis VLR)
AlGaAs				R1		R1		GaAs-AlGaAs Etch (Unaxis VLR)
InGaAlAs		InP-InGaAsP-InGaAlAs Etching (RIE 2)						InP-InGaAs-InAlAs Etch (Unaxis VLR)
InGaAsP		InP-InGaAsP-InGaAlAs Etching (RIE 2)						InP-InGaAs-InAlAs Etch (Unaxis VLR)
InP		InP-InGaAsP-InGaAlAs Etching (RIE 2)						InP-InGaAs-InAlAs Etch (Unaxis VLR)
GaN				GaN Etch (RIE 5)		R1		R1
AlGaN								R1
AlN								R1
GaSb								GaSb Etch Unaxis VLR)
CdZnTe		R1
ZnS		R1
ZnSe		R1
Si					R1								R1
SiC						R1	A
Sapphire						R1	A
Material	RIE 1 (Retired)	RIE 2 (MRC)	RIE 3 (MRC)	RIE 5 (PlasmaTherm)	Si Deep RIE (PlasmaTherm/Bosch Etch)	ICP Etch 1 (Panasonic E626I)	ICP Etch 2 (Panasonic E640)	ICP-Etch (Unaxis VLR)	Ashers (Technics PEII)	Plasma Clean (Gasonics 2000)	UV Ozone Reactor	Plasma Activation (EVG 810)	XeF2 Etch (Xetch)	Vapor HF Etch (uETCH)	CAIBE (Oxford)