Dry Etching Recipes

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• A = Material is available for use, but no recipes are provided.

Dry Etching Recipes
	RIE Etching				ICP Etching				Oxygen Plasma Systems				Other Dry Etchers
Material	RIE 1 (Retired)	RIE 2 (MRC)	RIE 3 (MRC)	RIE 5 (PlasmaTherm)	Si Deep RIE (PTI/Bosch)	ICP Etch 1 (Panasonic 1)	ICP Etch 2 (Panasonic 2)	ICP-Etch (Unaxis VLR)	Ashers (Technics PEII)	Plasma Clean (Gasonics 2000)	UV Ozone Reactor	Plasma Activation (EVG 810)	XeF2 Etch (Xetch)	Vapor HF Etch (uETCH)	CAIBE (Oxford)
Ag
Al				A		R1	R1
Au															R1
Cr				A		R1	A
Cu
Ge
Mo
Ni															R1
Pt															R1
Ru
Ta
Ti						R1	A
Al2O3
AlGaAs				R1		R1		GaAs-AlGaAs Etch (Unaxis VLR)
AlGaN								R1
AlN								R1
GaAs				R1		R1	R1	GaAs-AlGaAs Etch (Unaxis VLR)
GaN				GaN Etch (RIE 5)		R1		R1
HfO2
InGaAlAs		InP-InGaAsP-InGaAlAs Etching (RIE 2)						InP-InGaAs-InAlAs Etch (Unaxis VLR)
InGaAsP		InP-InGaAsP-InGaAlAs Etching (RIE 2)						InP-InGaAs-InAlAs Etch (Unaxis VLR)
InP		InP-InGaAsP-InGaAlAs Etching (RIE 2)						InP-InGaAs-InAlAs Etch (Unaxis VLR)
ITO		R1
SiO2			SiO2 Etching (RIE 3)			R1	R1							R1
SiN			SiNx Etching (RIE 3)			R1	R1
SiOxNy
Ta2O5
TiO2
TiN
W-TiW						R1	A
ZnO2
ZrO2
GaSb								GaSb Etch Unaxis VLR)
CdZnTe		R1
Si					R1								R1
SiC						R1	A
Sapphire						R1	A
ZnS		R1
ZnSe		R1
Material	RIE 1 (Retired)	RIE 2 (MRC)	RIE 3 (MRC)	RIE 5 (PlasmaTherm)	Si Deep RIE (PlasmaTherm/Bosch Etch)	ICP Etch 1 (Panasonic E626I)	ICP Etch 2 (Panasonic E640)	ICP-Etch (Unaxis VLR)	Ashers (Technics PEII)	Plasma Clean (Gasonics 2000)	UV Ozone Reactor	Plasma Activation (EVG 810)	XeF2 Etch (Xetch)	Vapor HF Etch (uETCH)	CAIBE (Oxford)