PECVD1 Wafer Coating Process

The wafers used for process calibration are ordered from SVM. These are low particle count 4" Si wafers (particle count<100). The wafers are scanned before and after deposition. They are not re-used. Handling the wafers is important and each step could contribute in adding new particles.The section bellow describes how to run standard recipes for SiN a,d SiO2 at 250C.

SiN @250C

1. Log in to PECVD #1
2. Seasoning
   • Load the seasoning recipe (SiN seasoning), and run it. The goal of this step is to coat chamber walls and prepare it for deposition.
3. Deposition
   • Vent the chamber and load the substrate (place it in the center of platen). You can place small pieces around the wafer to protect it from moving.
   • Pump down.
   • Load the deposition recipe (SiN@250C), and run it.
   • Unload the wafer.
4. Cleaning
   • Wipe sidewall first with DI water, followed by IPA.
   • Load the cleaning recipe (CH4/O2 clean). Edit the recipe and enter required time for cleaning.
   • Log out

SiO2 @250C

1. Log in to PECVD #1
2. Seasoning
   • Load the seasoning recipe( SiO2 seasoning), and run it. The goal of this step is to coat chamber walls and prepare it for deposition.
3. Deposition
   • Vent the chamber and load the substarte (place it in the center of platen). You can place small pieces around the wafer to protect it from moving.
   • Pump down.
   • Load the deposition recipe( SiO2@250C), and run it.
   • Unload the wafer.
4. Cleaning
   • Wipe sidewall first with DI water, followed by IPA.
   • Load for cleaning recipe (CF4/O2). Edit the recipe and enter required time for cleaning.
   • Log out